Hard and soft integrated electronic product shell and preparation method thereof

A technology for electronic products and casings, which is applied in the field of soft and hard electronic product casings and its preparation, which can solve the problems of elastic bodies that are easily deformed by force, joints that are easy to break, and contact areas that are small, etc., to achieve consistency The effect of non-resistance, not easy to disengage, and excellent rigidity

Active Publication Date: 2017-06-20
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing technology generally adopts the method of metal insert injection molding to connect the thermoplastic elastomer and the high-rigidity plate by injection molding. However, due to the small contact area between the thermoplastic elastomer and the high-rigidity plate in this technology, the seam is easily broken
[0005] There is also a technology that combines thermoplastic elastomers and metal sheets through the nano-injection molding (NMT) process. After the surface of the metal substrate is treated with T, the plastic is directly injection-molded on the metal surface, so that the metal and the plastic are integrally formed, but this technology In the prepared shell, the elastic body is easily deformed by force and detached from the micro-nano holes, so that the elastic body is separated from the metal plate

Method used

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  • Hard and soft integrated electronic product shell and preparation method thereof
  • Hard and soft integrated electronic product shell and preparation method thereof
  • Hard and soft integrated electronic product shell and preparation method thereof

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Embodiment Construction

[0035] In order to further understand the present invention, the preferred embodiments of the present invention are described below in conjunction with the examples, but it should be understood that these descriptions are only for further illustrating the features and advantages of the present invention rather than limiting the patent requirements of the present invention.

[0036] The present invention provides a soft-hard electronic product housing, comprising:

[0037] The rigid part is composed of metal foam, and the flexible part is composed of polymer elastic body; the metal foam and the polymer elastic body are fixedly connected.

[0038] The housing of the electronic product provided by the invention adopts metal foam to provide a rigid framework, and has excellent rigidity.

[0039] In the present invention, there is no special limitation on the metal type of the metal foam, and high-rigidity metals well known to those skilled in the art can be used.

[0040] The pre...

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Abstract

The invention provides a hard and soft integrated electronic product shell, comprising a rigid part formed by foamed metal and a flexible part formed by a polymer elastomer, wherein the foamed metal is fixedly connected with the polymer elastomer. According to the electronic product shell provided by the invention, a rigid framework is provided by using the foamed metal, and excellent rigidity can be achieved; and meanwhile, the polymer elastomer and the foamed metal are fixedly connected and are inserted to each other to form the locking force, and thus the metal and the elastomer are combined very firmly and cannot easily disconnect; and moreover, the appearance of the shell can be an integrated elastomer, and thus the consistency between the appearance effect and the hand feeling can be maintained.

Description

technical field [0001] The invention relates to the technical field of electronic product shells, in particular to an electronic product shell integrating soft and hard parts and a preparation method thereof. Background technique [0002] Flexible electronic technology is an emerging electronic technology that manufactures organic / inorganic material electronic devices on flexible / ductile plastic or thin metal substrates. , national defense and other fields have broad application prospects, such as flexible electronic displays, organic light-emitting diodes (OLEDs), printed RFID, thin-film solar panels, and electronic skin patches (Skin Patches). [0003] The flexible bending characteristics of flexible electronic products put forward special requirements for the product shell. Some designated areas of the shell are required to be rigid and inelastic, while other areas are required to be soft and elastic. [0004] In the prior art, the metal insert injection molding method i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00B29C45/14
CPCB29C45/14H05K5/0013B29K2715/003B29C67/246B29L2031/3481B29K2705/00H05K5/0217B29C45/14065
Inventor 范小利左常龙
Owner LENOVO (BEIJING) CO LTD
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