High-temperature adhesive tape production process and high-temperature adhesive tape
A high-temperature tape and production process technology, applied in the direction of adhesives, film/flake adhesives, etc., can solve the problems of loose wrapping, data lines are easy to spread, and the surface layer of data lines is easy to scratch, and it is not easy to loosen. on effect
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Embodiment 1
[0048] This embodiment provides a production process of high temperature adhesive tape. Please refer to figure 1 , 2 3 and 3 are respectively the schematic diagrams of circular knife machine feeding during high-temperature tape production, the schematic diagrams of copper foil tape composite differential feeding, and the schematic diagrams of copper foil tape composite differential feed.
[0049] Please refer to Figure 1-3 , The production process of high-temperature tape includes the following steps: material preparation, slitting / slitting and lamination punching.
[0050] In the material preparation step, prepare black PET film, copper foil tape, yellow PI silica gel and transparent fluorine release film raw materials according to the amount of finished products to be prepared; in this example, prepare black PET film with a thickness of 0.05mm and model D250 , model is the copper foil adhesive tape of MXCU-110-0003AP, 500 gram models are the yellow PI silica gel of MXPI-...
Embodiment 2
[0069] This embodiment provides a high-temperature adhesive tape. The high-temperature adhesive tape of this embodiment is prepared by the high-temperature adhesive tape production process of Embodiment 1. Please refer to Figure 4 and 5 , are the structural diagram and exploded diagram of the high temperature adhesive tape respectively.
[0070] High-temperature tape includes: yellow PI silica gel 4, copper foil tape 3, black PET film 2 and transparent fluorine release film 1; black PET film 2 is attached to the film surface of transparent fluorine release film 1; copper foil tape 3 Attached to the film surface of the transparent fluorine release film 1; the yellow PI silica gel 4 is attached to the copper foil surface A1 of the copper foil tape 3, and covers the transparent fluorine release film 1. In one embodiment, the high-temperature adhesive tape also includes: a first OPP transparent protective film and a second OPP transparent protective film; the first OPP transpare...
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