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Electronic package

An electronic package and packaging layer technology, which is applied to electrical components, circuit devices, electrical solid devices, etc., can solve the problems that the wireless communication module 1 is not easy to operate, and cannot operate with high bandwidth.

Inactive Publication Date: 2017-06-30
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing wireless communication module 1, the antenna part 131 is a complete rectangular plate, such as figure 1 ’, so the electromagnetic radiation characteristics of the antenna part 131 will operate at a low bandwidth (2.4GHz to 5.8GHz), and cannot operate at a high bandwidth
[0005] Furthermore, because the scattered emission of electromagnetic radiation will affect the operation of other electronic components, it is often difficult for the wireless communication module 1 to operate.

Method used

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Embodiment Construction

[0052] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0053] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation of the present invention. condition, so it has no technical substantive meaning, and any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of the present invention without affecting the effect and purpose of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second", and "a" quoted in ...

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Abstract

An electronic package is provided, which includes a substrate and an antenna board structure disposed on the substrate. The antenna board structure has a first portion, a second portion and a partition portion between the first portion and the second portion. As such, current can be split into two paths so as to spread electromagnetic radiation, and thus produce electromagnetic radiation with a high bandwidth.

Description

technical field [0001] The invention relates to an electronic package, in particular to an electronic package with an antenna structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the appearance design requirements of consumer electronic products, the manufacture and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, the planar antenna (Patch Antenna) is small in size, light in weight, and easy to manufacture. characteristics and are widely used in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDA). [0003] figure 1 A three-dimensional s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L23/66H01Q1/24H01Q1/52
CPCH01L23/552H01L23/66H01Q1/24H01Q1/52H01Q1/2283H01Q1/38H01Q9/0407H01L2224/04105H01L2224/12105H01L23/49822H01L23/3128H01L23/49816H01L2223/6677H05K1/0216H05K1/115H05K1/185H05K2201/0723H05K2201/09209
Inventor 张峻源蔡明汎林河全卢盈维马光华
Owner SILICONWARE PRECISION IND CO LTD