Efficient computer cooling apparatus

Abstract

The invention provides a high-efficiency computer heat dissipation device, which includes a heat dissipation substrate, a heat dissipation fin, a heat conduction fin, a heat conduction pipe and an exhaust device. The heat sink is uniformly provided with cooling holes, the outer wall of the heat dissipation substrate is provided with a conduit groove, the conduit groove is provided with a heat pipe, and the bottom of the heat dissipation substrate is provided with a heat conduction sheet. The upper end is equipped with an exhaust device. The exhaust device is a small fan. The beneficial effect of the present invention is that due to the adoption of the above technical solution, the heat dissipation device changes from the usual single heat dissipation to multiple heat dissipation, the increased heat dissipation area improves heat dissipation efficiency, and improves the working efficiency of the radiator. And various components are detachable structures, easy to clean and maintain.

Description

technical field [0001] The invention belongs to the field of computer accessories, in particular to a high-efficiency computer cooling device. Background technique [0002] In the existing technology, when the computer is working, high temperature will be generated inside the case. With the continuous progress and continuous upgrading of computer technology, the integrated circuits of the computer are becoming more and more sophisticated and smaller and smaller. Because the increase in temperature will affect the work of the various components in the computer, it is necessary to add a cooling device to reduce the temperature of the computer. But adopt this method to dissipate heat, although the exhaust device blows the air to the chip, the heat in the chip cannot be transferred out, which leads to poor heat dissipation effect, easily causes damage to the chip, and affects the work of the computer. Contents of the invention [0003] The technical scheme adopted in the pres...

AI Technical Summary

Problems solved by technology

Because the increase in temperature will affect the work of various components in the computer, it is necessary to add a cooling device to reduce the temperature of the computer. However, at present, an exhaust device is installed in the chassis, and the exhaust device is used to dissipate heat from the chips in the computer. However, with this method of heat dissipation, although the exhaust device blows air to the chip, the heat in the chip cannot be transmitted, which leads to poor heat dissipation effect, easy to cause damage to the chip, and affect the work of the computer

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