Water-cooled power combiner for high-power solid state power amplifier
A technology of power synthesizer and solid-state power amplifier, applied in the field of radio frequency, can solve the problems of inconvenient maintenance, bulky, and affect the appearance, and achieve the effect of small occupied space, high heat dissipation efficiency, and easy maintenance and repair.
Active Publication Date: 2017-07-14
BEIJING BBEF SCI & TECH
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Problems solved by technology
Because the fan needs electricity, lead wires, and a support frame, it is bulky, affects the appearance, and causes inconvenience in maintenance
Method used
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[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.
[0017] Such as Figure 1-3 As shown, a water-cooled power combiner for high-power solid-state power amplifiers, the combiner adopts an inner and outer double-layer structure, including a cylindrical inner conductor 1, one end of the inner conductor 1 is provided with a center conductor 2, and the center conductor 2 is provided with Connecting conductors 3 arranged along the circumference of the inner conductor 1, the other end of the inner conductor 1 is provided with a first outer conductor 4, the end of the first outer conductor 4 close to the central conductor is provided with an outer step 5, and the first outer conductor 4 is located near the outer step 5 There are heat dissipation teeth arranged in the circumferential direction; the center conductor 2 is provided with a second outer conductor 6, and one...
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The invention discloses a water-cooled power combiner for a high-power solid state power amplifier. The water-cooled power combiner for a high-power solid state power amplifier comprises an inner conductor, a central conductor, a connecting conductor, a first outer conductor, a second outer conductor, a third outer conductor and an input port; the central conductor is arranged at one end of the inner conductor; the first outer conductor, the second outer conductor and the third outer conductor are arranged outside the inner conductor and the central conductor; and a first water channel and a second water channel are respectively arranged at the position near the central conductor inside the third outer conductor and the second outer conductor. According to the invention, the inner and outer double-layer structure is adopted by the water-cooled power combiner provided by the invention, and the water-cooling channel is arranged in the outer structure, therefore, the water-cooling heat dissipation of the multi-channel power combiner is realized, and the idea of water-cooling for the power combiner is realized. The water-cooled power combiner has the advantages of high heat dissipation efficiency, small space occupation, omitting external heat dissipation mechanism, convenient for maintenance and service, and can realize the circulating cooling of the power amplifier plug-in unit.
Description
technical field [0001] The invention relates to the field of radio frequency technology, in particular to a water-cooled power combiner for multi-channel high-power solid-state power amplifiers. Background technique [0002] Due to the development of science and technology, people continue to deepen their research on basic physics, light sources and superconductivity. With the wide application of all-solid-state power amplifiers in high-power fields such as electron accelerators and laser sources, the power level of solid-state power amplifiers continues to increase. The number of power amplifiers is decreasing. The reduction in the number of power amplifiers and the increase in the power of the power amplifier will inevitably increase the loss of the power combiner and increase the temperature of the power combiner. The previous solution was to add fans to dissipate heat. Because the fan needs electricity, lead wires, and a support frame, it is bulky, affects the appear...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/473H05K7/20
CPCH01L23/473H05K7/20263H05K7/20272
Inventor 张建华刘继福
Owner BEIJING BBEF SCI & TECH