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Secondary glue joint pressing method for thin composite material plate

A composite material board and composite material technology, which is applied in the manufacture of composite material parts of the driver's cabin door frame, composite material manufacturing, and the secondary bonding and pressing of thin composite material boards. It can solve product warping, weak bonding, Problems such as debonding

Inactive Publication Date: 2017-07-21
HARBIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unable to meet the curing pressure of 0.2MPa required for secondary pressurization
There are defects in the bonding quality of the product, such as dents, excessive thickness of the adhesive layer, warping of the product, debonding of the bonding surface, debonding, weak bonding, etc.
Existing methods cannot produce qualified products

Method used

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  • Secondary glue joint pressing method for thin composite material plate
  • Secondary glue joint pressing method for thin composite material plate

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Embodiment Construction

[0028] The process method of the invention can realize the secondary adhesive bonding manufacture of the thin composite material plate structure, improve product quality, and avoid debonding between composite material parts.

[0029] The method of the invention is as follows: pre-installation of the thin composite material plate → preparation of the surface of the composite material → laying of the adhesive film → placement of the pressurizing device → curing in the curing oven → demoulding → trimming, and the secondary bonding molding is completed. This method is suitable for secondary bonding molding of any curved and flat thin composite material panels.

[0030] Step 1. Pre-install the two thin composite material panels to be bonded on the bonding fixture, and take them out after accurate positioning;

[0031] Step 2. Wipe the surfaces of the two thin composite material panels to be glued, and wipe the surface of the thin composite material panels with a white lint-free wip...

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Abstract

The invention belongs to the technical field of composite materials, and particularly relates to a secondary glue joint pressing method for a thin composite material plate. According to the secondary glue joint pressing method for the double-curvature-surface thin composite material plate, the pressing method used as the drawing is adopted in secondary glue joint compression; and then curing and demolding are performed in a curing oven according to the curing parameters of the material, and accordingly secondary glue joint is completed. The process stability is high, a pressure application device can be prepared easily, and operation is easy. Meanwhile, helpful experience is provided for other plane types.

Description

Background technique [0001] The invention belongs to the technical field of composite materials, in particular to a method for secondary bonding and pressing of thin composite material plates. [0002] current technology [0003] In order to reduce product weight, aviation products are made of thin composite material boards (thickness less than 2mm), formed by secondary bonding technology, using the existing method, that is, vacuum bag pressurization, and the maximum applied pressure cannot exceed 0.06MPa. The curing pressure of 0.2 MPa required for secondary pressurization cannot be met. There are defects in the bonding quality of the product, such as sags, excessive thickness of the adhesive layer, warping of the product, debonding of the bonding surface, debonding, weak bonding and other defects. Such as further manufacturing and assembly drilling, delamination in the hole, and delamination of the composite material plate on the outlet surface. Existing method can't manu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/42
Inventor 于立波朗强李乾玥张卓轶高晓影齐国强郑希奇尹玉东吴兆福高宏飞
Owner HARBIN
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