Supporting layer for substrate cutting, machine platform and method for cutting substrates using the machine platform

Abstract

The invention provides a supporting layer and machine board for cutting a substrate as well as a method for cutting the substrate by adopting the machine board. The supporting layer comprises a supporting layer body, wherein the supporting layer body comprises a putting surface for putting a to-be-cut substrate and an opposite end face opposite to the putting surface; the putting surface comprises an air current channel area and an air current closing area; the putting surface can realize air current communication in the air current channel area and the opposite end face and cannot realize the air current communication in the air current closing area and the opposite end face; a projection of a precutting line of the to-be-cut substrate on the putting surface is positioned in the air current closing area. The supporting layer for cutting the substrate, provided by the invention, is arranged on the machine board for cutting the substrate; the air current channel area and the air current closing area are formed on the putting surface for supporting the to-be-cut substrate, and can be used for adsorbing and fixing the to-be-cut substrate, preventing the cutting line of the to-be-cut substrate from passing through an adsorbing hole area, and preventing the edge of the to-be-cut substrate from generating stress cracks.

Description

technical field [0001] The invention relates to the technical field of display manufacturing, in particular to a support layer for cutting a substrate, a machine platform and a method for cutting a substrate by using the machine platform. Background technique [0002] When manufacturing a display, it is a common process to cut a large-area substrate into multiple small-area units. For the above cutting process, laser cutting is usually used at present, and before laser cutting, such as figure 1 As shown, the substrate 1 to be cut is fixed on the machine platform 2, and the substrate 1 to be cut is adsorbed and fixed on the machine platform 2 through the suction hole 3 provided on the machine platform 2, and the negative pressure generated by vacuuming the suction hole 3 is used. In order to avoid offset in the cutting process. [0003] However, when the substrate 1 to be cut is a flexible substrate and the substrate 1 to be cut is fixed on the machine 2 for laser cutting i...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the technical solution of the present invention is to provide a support layer for substrate cutting, a machine platform and a method for cutting a substrate using the machine platform, so as to solve the problem of the edge of the cut substrate in the prior art when the cutting scanning path passes through the adsorption hole on the machine platform. The problem of stress cracking

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