Non-contact semiconductor wafer thickness measurement device

A non-contact, semiconductor technology, applied in measurement devices, optical devices, instruments, etc., can solve problems such as affecting product consistency, low detection speed, affecting product quality, etc., to solve the problem of easily damaged wafer surface, and realize full automation , Solve the effect of low measurement efficiency

Inactive Publication Date: 2017-07-28
BEIJING JIAOTONG UNIV
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  • Abstract
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  • Application Information

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Problems solved by technology

[0002] In the processing of semiconductor materials, many processing procedures need to measure the thickness and uniformity of the wafer. Sometimes it is necessary to measure the thickness of the wafer alone, and sometimes it is necessary to measure the thickness of multiple wafers adhered to the ceramic disk. In order to ensure flexible measurement At present, most processing companies u

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  • Non-contact semiconductor wafer thickness measurement device
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  • Non-contact semiconductor wafer thickness measurement device

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Embodiment Construction

[0024] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0025] Those skilled in the art will understand that unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the word "comprising" used in the description of the present invention refers to the presence of said features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, Integers, steps, operations, elements, components, and / or groups thereof. It will be understoo...

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Abstract

The invention provides a non-contact semiconductor wafer thickness measurement device, which includes a test-piece tray, a tray translation screw, a base, a test-piece rotating motor and a laser displacement sensor. The base is fixed on a measuring table. The tray translation screw is arranged on the base. A measured wafer or ceramic plate is placed on the test-piece tray. The test-piece tray is connected with the tray translation screw and the test-piece rotating motor. The tray translation screw drives the test-piece tray to perform parallel translation. The test-piece rotating motor drives the test-piece tray to rotate. The laser displacement sensor is located above the test-piece tray. The laser displacement sensor measures the distance from the measured wafer or a wafer on the ceramic plate to the measurement datum. The device in the embodiment of the invention can automatically and accurately measure the thickness of a monolithic wafer and multiple wafers adhered to the ceramic plate, solves the problems that the measurement of a semiconductor wafer is low in efficiency and can easily damage the surface of the wafer at present, and enables the whole measurement process to be fully automated.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer measurement, in particular to a non-contact semiconductor wafer thickness measuring device. Background technique [0002] In the processing of semiconductor materials, many processing procedures need to measure the thickness and uniformity of the wafer. Sometimes it is necessary to measure the thickness of the wafer alone, and sometimes it is necessary to measure the thickness of multiple wafers adhered to the ceramic disk. In order to ensure flexible measurement At present, processing companies mostly use micrometers to manually detect the thickness of wafers one by one. Not only is the detection speed low, but the detection accuracy will also vary due to differences in operators and operating environments, affecting product consistency. At the same time, improper operation of the micrometer clamping chip will cause damage to the chip and affect product quality. [0003] Therefore, i...

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Application Information

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IPC IPC(8): G01B11/06
CPCG01B11/0691
Inventor 聂蒙曹建国朱朋哲李建勇樊文刚刘月明
Owner BEIJING JIAOTONG UNIV
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