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A Shape Reconstruction Method for Subsurface Defects in Thermal Imaging Inspection

A subsurface defect, thermal imaging technology, used in material defect testing and other directions to achieve the effect of quantitative analysis

Active Publication Date: 2019-04-05
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art, and propose a method for reconstructing the shape of subsurface defects in thermal imaging detection, so as to facilitate the quantitative evaluation of subsurface defects and solve the problem of quantifying subsurface defects when surface excitation is used. analyse problem

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  • A Shape Reconstruction Method for Subsurface Defects in Thermal Imaging Inspection
  • A Shape Reconstruction Method for Subsurface Defects in Thermal Imaging Inspection
  • A Shape Reconstruction Method for Subsurface Defects in Thermal Imaging Inspection

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Embodiment Construction

[0027] Specific embodiments of the present invention will be described below in conjunction with the accompanying drawings, so that those skilled in the art can better understand the present invention. It should be noted that in the following description, when detailed descriptions of known functions and designs may dilute the main content of the present invention, these descriptions will be omitted here.

[0028] figure 1 It is a schematic diagram of the structure of the infrared thermal imaging non-destructive testing system.

[0029] In this example, if figure 1 As shown, the infrared thermal imaging non-destructive testing system usually consists of four parts: (1) thermal excitation part (induction heating source and excitation coil); (2) infrared thermal image acquisition part (infrared thermal imager); (3) control test Part moving part (stepping motor); (4) infrared thermal image processing and analysis part (computer); in addition, it also includes a pulse generator ...

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Abstract

The invention discloses a sub-surface defect shape reconstruction method in thermal imaging detection, which is divided into the acquisition process of thermal response signals, the phase difference solution process between defective areas and non-defective areas, and the use of envelopes to reconstruct defect shapes The process has three parts. Use a line heat source to scan the test piece, and then perform Fourier analysis on the data collected at the location of the heating source to find the phase difference corresponding to other positions and no defects, and invert the depth of the defect according to the phase difference, and then according to each The result of the position line scanning is the obtained depth to make the envelope, and finally estimate the shape of the defect according to the envelope. The invention is capable of estimating and reconstructing the shapes of irregular defects, which is beneficial to the quantitative evaluation of defects, and solves the problem of quantitative analysis of such defects when surface excitation is adopted.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing of specimens containing subsurface defects, and more specifically relates to a shape reconstruction method for subsurface defects in thermal imaging testing. Background technique [0002] With the continuous development of science and technology, the quality and safety of mechanical equipment or components has become an issue of increasing concern. Infrared thermal imaging non-destructive testing technology plays an indispensable role in the safe operation of equipment, product quality control and ensuring that equipment is in a safe and reliable state. With its unique advantages, infrared thermal imaging non-destructive testing technology has become a new type of digital testing technology that is currently focused on development. Compared with traditional detection technology, it has the advantages of wide application range, non-contact, fast speed, on-site use, high precision, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/72
CPCG01N25/72
Inventor 白利兵朱晨晨程玉华陈雪张杰殷春甘文东何棱云
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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