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Target assembly

A technology of target components and insulating plates, which is applied in the field of target components, can solve the problems of difficult removal of insulating material films and inconvenient reuse of backplanes, and achieve the effects of easy reuse and suppression of abnormal discharge

Active Publication Date: 2017-08-01
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the aforementioned prior application, it is necessary to remove the insulating material film before removing the adhesive material, and the insulating material film is difficult to remove.
Furthermore, it is necessary to form an insulating material film again after bonding unused targets to the backplane, and the backplane is inconvenient to reuse

Method used

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Embodiment Construction

[0023] Hereinafter, referring to the drawings, a target assembly according to an embodiment of the present invention will be described by taking a product mounted on a sputtering apparatus as an example. Below to figure 1 As a reference, the inside top side of the vacuum chamber 1 is described as "upper" and the bottom side thereof as "lower".

[0024] Such as figure 1 As shown, the sputtering apparatus SM has a vacuum chamber 1 defining a process chamber 1a. The bottom of the vacuum chamber 1 is connected to a vacuum pump P made of a turbomolecular pump or a rotary pump through an exhaust pipe, and can be evacuated to a specified pressure (for example, 10 －5 Pa). A gas pipe 12 connected to a gas source not shown in the figure and having a mass flow controller 11 inserted therein is connected to the side wall of the vacuum chamber 1, and a sputtering gas composed of a rare gas such as Ar can be introduced into the processing chamber 1a at a predetermined flow rate. .

[0...

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PUM

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Abstract

Provided is a target assembly capable of reliably preventing a bonding material that bonds a target and a backing plate from oozing to the outside, while suppressing abnormal electrical discharge between an extended portion of the backing plate and a side surface of the target, said target assembly also being capable of facilitating the reuse of the backing plate. A target assembly (2) according to the present invention is provided with a target (21) that is formed from an insulator, and with a backing plate (22) that is bonded to one surface of the target via a bonding material, the backing plate having an extended portion (22a) extending to the outside from the outer circumferential end of the target. The target assembly (2) is further provided with an annular insulation plate (23) that surrounds the periphery of the target with a predetermined gap relative to the side surface of the target, covers a target-side surface of the extended portion, and is removably attached to the backing plate.

Description

technical field [0001] The present invention relates to a target assembly assembled on a sputtering device, in particular to a back plate having an insulating material target and a back plate bonded to one side of the target by an adhesive material, the back plate has a The outer extension extends the target assembly. Background technique [0002] For example, in the manufacturing process of NAND flash memory and MRAM (magnetoresistive memory), a process of forming an insulating film such as an aluminum oxide film or a magnesium oxide film is performed, and a sputtering device is used for mass production of the insulating film. In such a sputtering device, a target assembly detachably assembled in a vacuum chamber that can be evacuated is composed of a target that is appropriately selected according to the composition of the thin film to be formed and a cooling device for cooling when sputtering the target to form a film. The back panel is integrally formed. [0003] Such ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34H01L21/31
Inventor 中村真也池田佳广宫口有典桥本一义堤贤吾藤井佳词
Owner ULVAC INC
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