POS machine safety contact pressure test device and test method
A technology of safety contacts and POS machines, applied in the field of testing, can solve the problems of inability to accurately measure the critical pressure value of safety contacts triggering, affecting the preload and tolerance of silicone pads, etc.
Active Publication Date: 2017-08-04
5 Cites 0 Cited by
AI-Extracted Technical Summary
Problems solved by technology
The invention relates to the field of test, in particular to a POS machine safety contact pressure test device and a test method. The shape of a circuit board is cut in a special way to form a cantilever beam, and the safety contact is arranged at the free end of the cantilever beam. The influence of deformation of other parts of the circuit board on the measurement value at a measurement position of a strain gauge under the condition that a POS machine is locked can be avoided. When the joint of the cantilever beam and the circuit board deforms, the strain gauge arranged at the fixed end acquires a strain value, and the pressure value of the safety contact of a POS machine is calculated by a processor. The whole test process has nothing to do with the amount of compression of a silica gel pad. Therefore, the pressure value of the safety contact can be measured accurately under the condition that a POS machine is locked.
Cash registersApparatus for force/torque/work measurement
Strain gaugeX-machine +5
- Experimental program(2)
Description & Claims & Application Information
We can also present the details of the Description, Claims and Application information to help users get a comprehensive understanding of the technical details of the patent, such as background art, summary of invention, brief description of drawings, description of embodiments, and other original content. On the other hand, users can also determine the specific scope of protection of the technology through the list of claims; as well as understand the changes in the life cycle of the technology with the presentation of the patent timeline. Login to view more.