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Grinding device

A technology for grinding and grinding surfaces, which is applied in the direction of grinding devices, grinding/polishing safety devices, and parts of grinding machine tools. Improve productivity, remove reliably, and prevent loss of finish thickness accuracy

Active Publication Date: 2020-10-09
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, it is difficult to discharge the grinding chips that have entered the holding surface of the porous holding table by means of a fluid cleaning mechanism that sprays fluid onto the holding surface.
On the other hand, when cleaning the holding surface by a brush or stone, there is a problem that the accuracy of the parallelism between the holding surface and the grinding surface of the grinding tool decreases due to the change in the shape of the holding surface. Decreased finish thickness accuracy after wafer grinding
In particular, when the holding surface is cleaned every time a wafer is ground, the accuracy of parallelism between the holding surface and the grinding surface of the grinding tool tends to decrease, and this becomes a major cause of decreased productivity.

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0022] figure 1 The shown grinding apparatus 1 is an apparatus that performs grinding processing on a wafer W held on a holding table 2 by grinding units 3 a and 3 b.

[0023] Cassette mounting areas 4a, 4b are provided on the front side of the grinding apparatus 1, and a cassette 40a and a cassette 40b are mounted in the cassette mounting areas 4a, 4b, respectively. The cassette 40a accommodates wafers W before grinding. , the cassette 40b accommodates the wafer W after grinding.

[0024] A loading / unloading unit 5 for loading / unloading wafers W into / from the cassettes 40a, 40b is arranged near the cassette mounting areas 4a, 4b. The wafer W carried out from the cassette 40a by the carry-out unit 5 is placed on the alignment table 50, where the center of the wafer W is aligned at a predetermined position. The alignment table 50 has a rotation unit 51 capable of rotating the wafer W placed on the alignment table 50 . Further, on the side of the alignment table 50, there is ...

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Abstract

Provided is a grinding device capable of reliably and efficiently removing grinding chips on a holding surface and preventing reduction in finish thickness accuracy of a wafer after grinding due to a change in shape of the holding surface of a holding table. In the grinding device, there are: a cleaning unit (8), which makes the cleaning abrasive (82) contact with the holding surface (2a) and presses to scrape off the grinding chips; a crack detection unit (90), which detects the The crack on the ground surface of the wafer is detected; and the control unit (91), when a crack is detected, it makes the cleaning unit (8) clean the holding surface (2a), because only when the crack is on the ground surface of the wafer When a crack is detected, the grinding debris entering the holding surface (2a) is discharged, so the grinding debris on the holding surface (2a) is reliably and efficiently removed, and the wafer is prevented from being damaged due to the shape change of the holding surface (2a). The finish thickness accuracy after grinding is reduced.

Description

technical field [0001] The present invention relates to a grinding device for grinding wafers. Background technique [0002] In the grinding apparatus, the wafer is held on a holding table formed in a porous shape, and the grinding wheel is brought into contact with the surface to be ground of the wafer to be pressed to grind the surface to be ground. The holding surface of the table is parallel to the grinding surface of the grinding tool to improve the thickness accuracy of the ground wafer. [0003] However, there is a problem that cracks may be generated on the wafer when the grinding stone is pressed against the grinding wheel while the wafer is held in this state by attaching grinding chips generated by grinding to the holding surface. Therefore, in the grinding apparatus, a cleaning mechanism for cleaning the holding surface of the holding table is provided, and according to the timing when the grinding of one wafer is completed and separated from the holding table, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B7/22B24B37/10B24B37/30B24B27/00B24B37/34B24B37/005B24B55/06B08B3/02
CPCB08B3/02B24B7/228B24B27/0023B24B27/0069B24B27/0076B24B37/005B24B37/107B24B37/30B24B37/345B24B55/06H01L21/02013B24B37/04B24B49/12B24B9/065H01L21/304H01L21/30625
Inventor 吉田真司
Owner DISCO CORP