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Method for fabricating glass substrate package

A glass substrate and substrate technology, applied in the field of packaging systems, can solve problems such as complex size and function

Active Publication Date: 2017-08-15
杨秉荣
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These packaging technologies can be used not only for single-chip packaging, but also for higher-level or higher-integration-level packaging. However, substrates with larger dimensions and more complex functions are required to accommodate multiple chips to form a more powerful system. unit

Method used

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  • Method for fabricating glass substrate package
  • Method for fabricating glass substrate package
  • Method for fabricating glass substrate package

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Experimental program
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Embodiment Construction

[0038] figure 1 A three-dimensional schematic diagram of a horizontal network cable 2 and a network cable 4 is disclosed, wherein the network cable 4 is located below the network cable 2, the network cable 2 includes a plurality of Y axes 2a and a plurality of X axes 2b located on the Y axis 2a, and the network cable 4 includes a plurality of A Y axis 4a and a plurality of X axes 4b located at the Y axis 4a, and a plurality of gaps 3 are formed in the mesh line 2, and a plurality of gaps 5 are formed in the mesh line 4, wherein the Y axis 2a, the X axis 2b, The Y-axis 4a and the X-axis 4b have the same diameter (or width), such as between 10 microns and 30 microns, between 20 microns and 100 microns, between 40 microns and 150 microns, between Between 50 microns and 200 microns, between 200 microns and 1000 microns, or between 500 microns and 10000 microns. The materials of the Y-axis 2a, the X-axis 2b, the Y-axis 4a and the X-axis 4b are metal wires or polymer wires, such as...

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Abstract

A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the solid glass core beginning at the first surface and ending at the second surface, wherein one of the conductors has a third surface and a fourth surface, wherein the third surface and the first surface are substantially coplanar, wherein the second surface and the fourth surface are substantially coplanar, wherein the solid glass core is directly contact with the conductor; and a first dielectric layer and a first metal layer formed at the first surface, wherein the first metal layer at the first surface is electrically coupled with one of the conductors.

Description

technical field [0001] The invention discloses the manufacturing method and structure of the glass substrate, and discloses several embodiments related to setting one or more chips on the glass substrate to establish a packaging system. Background technique [0002] Size reduction, thinning and function development of electronic devices are well-known trends, and disposing a semiconductor package on a motherboard is also a trend to achieve high integration. [0003] When the geometric size of integrated circuits is scaled down, the cost of each chip is reduced and the performance is improved. Among them, the metal connection between integrated circuits and other circuits and system components becomes more important, but the shrinking size of electronic devices makes this Metal connections are becoming more and more unfavorable, for example, factors such as increased parasitic capacitance and resistance of metal interconnections will degrade chip performance. The most import...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/538H01L21/48
CPCH01L21/4846H01L23/5385H01L23/5386H01L2224/16225H01L2224/48091H01L2224/48227H01L2224/48465H01L2224/73204H01L2224/73265H01L2924/00014H01L2924/00
Inventor 杨秉荣
Owner 杨秉荣