Semiconductor device structure
A semiconductor and component technology, applied in the field of semiconductor component structure, can solve problems such as difficult implementation of manufacturing process
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[0040] The following disclosure provides many different embodiments, or examples, for implementing different features of the present invention. However, the following disclosure of the present disclosure describes specific examples of each component and its arrangement in order to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if the following content of the present disclosure describes that a first feature is formed on or above a second feature, it means that it includes an embodiment in which the formed first feature and the second feature are in direct contact, Embodiments in which additional features can be formed between the above-mentioned first feature and the above-mentioned second feature, so that the above-mentioned first feature and the above-mentioned second feature may not be in direct contact are also included. Furthermore, the following description mentions that the first process is performed before th...
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