Die for forming earphone shell
A shell and mold technology, which is applied in the field of earphone device manufacturing, can solve the problems of high input cost, poor product quality, and low economic benefits, and achieve the effects of improving production efficiency, easy operation, and convenient use
Inactive Publication Date: 2017-08-18
东莞市誉恒电子有限公司
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Problems solved by technology
[0002] The earphone is composed of various parts that cooperate with each other. The quality of the earphone shell affects the service life of the earphone product. In order to improve the product quality, the manufacturing process of the earphone shell is usually improved. However, due to the defects of the existing technology and the limitation of the manufacturing process, The structure of injection molded parts of earphones is complex, the quality of the produced products is poor, the product rejection rate is high, the input cost is high, the processing cycle of the mold is long, and the economic benefit is not high
Method used
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Embodiment Construction
[0011] Such as figure 1 As shown, the mold of the molded earphone housing of the present invention includes a panel 1 and a bottom plate 11, and a front mold core 3 and a rear mold installed between the panel 1 and the bottom plate 11 by the front mold fixing plate 2 and the rear mold fixing plate 16 Kernel 13, and the resetting device installed under the rear mold fixing plate 16, and the division cylinder 12 fixed on the base plate 11; the division cylinder 12 extends to the front through the reset device, the rear mold fixing plate 16 and the rear mold kernel 13 The mold core 13; the top of the panel 1 is provided with a nozzle 14; the two sides of the front mold core 3 and the rear mold core 13 are equipped with an inclined guide post 4 and a slider 5 through a shovel base mechanism component 15; the slider 5 is installed on the bottom of the inclined guide post 4; the top of the inclined guide post 4 is assembled with the front mold fixing plate 2.
[0012] The resetting...
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The invention relates to the technical field of earphone device manufacturing, in particular to a die for forming an earphone shell. The die comprises a face plate, a bottom plate, a front die core, a rear die core, a reset device and an ejector sleeve. The front die core and the rear die core are installed between the face plate and the bottom plate through a front die fixing plate and a rear die fixing plate. The reset device is installed below the rear die fixing plate. The ejector sleeve is fixed to the bottom plate. The ejector sleeve penetrates the reset device, the rear die fixing plate and the rear die core and extends to the front die core. A sprue bushing is arranged on the top of the face plate. The two sides of the front die core and the two sides of the rear die core are provided with oblique guide pillars and sliding blocks through shovel base mechanisms. The sliding blocks are installed at the bottoms of the oblique guide pillars. The tops of the oblique guide pillars and the front die fixing plate are assembled. The die for forming the earphone shell is easy and convenient to operate, simple in structure and convenient to use, a machined and formed rubber piece can be smoothly disengaged from the die, the production efficiency is improved, and the die belongs to the core and key technology in earphone device manufacturing.
Description
technical field [0001] The invention relates to the technical field of earphone device manufacturing, in particular to a mold for forming an earphone shell. Background technique [0002] The earphone is made up of various components that cooperate with each other. The quality of the earphone shell affects the service life of the earphone product. In order to improve the product quality, the manufacturing process of the earphone shell is usually improved. However, due to the defects of the existing technology and the limitation of the manufacturing process, The structure of the injection molded part of the earphone is complex, the quality of the obtained product is poor, the product rejection rate is high, the input cost is high, the processing cycle of the mold is long, and the economic benefit is not high. Therefore, in order to solve the above problems, it is urgent to design a mold for an earphone housing with high production efficiency. Contents of the invention [00...
Claims
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IPC IPC(8): B29C45/26B29C45/33B29C45/40
CPCB29C45/26B29C45/332B29C45/4005
Inventor 孔凡华孔德欢曾志威
Owner 东莞市誉恒电子有限公司