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Preparation method of flexible display, flexible display and display equipment

A flexible display and display device technology, which is applied in the direction of instruments, nonlinear optics, optics, etc., can solve problems such as equipment failure, reliability decline, and material cracking, and achieve the goals of improving reliability, reducing frame size, and avoiding open circuits Effect

Active Publication Date: 2017-08-29
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a method for preparing a flexible display, a flexible display and a display device, so as to solve the problems of equipment failure and reliability reduction caused by material cracking in the bending area

Method used

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  • Preparation method of flexible display, flexible display and display equipment
  • Preparation method of flexible display, flexible display and display equipment
  • Preparation method of flexible display, flexible display and display equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] refer to figure 1 , shows a flowchart of steps of a method for manufacturing a flexible display provided by an embodiment of the present invention. The methods include:

[0037] Step 101, forming metal leads on the flexible substrate.

[0038] In this embodiment, the flexible substrate 201 is formed according to a conventional process, and the metal lead 202 is formed from the first or second metal layer of the display area on the flexible substrate 201, such as figure 2 Shown is a flexible substrate formed with metal leads.

[0039] Step 102, bending the flexible substrate and the metal leads.

[0040] In this embodiment, after the metal leads 202 are formed on the flexible substrate 201, the flexible substrate 201 and the metal leads 202 are bent to reduce the frame size of the flexible display, as shown in Figure 3a The bent flexible substrate is shown. Metal leads may break during bending, or break during subsequent use, such as Figure 3b The bent flexible ...

Embodiment 2

[0045] refer to Figure 5 , shows a flowchart of steps of a method for manufacturing a flexible display provided by an embodiment of the present invention. The methods include:

[0046] Step 301, forming metal leads on the flexible substrate.

[0047] Step 302, bending the flexible substrate and the metal leads.

[0048] The above steps are similar to steps 101-102 in the first embodiment, and will not be repeated here.

[0049] Step 303, immersing the bent part of the metal lead into a chemical solution, wherein the chemical solution contains a metal salt and a reducing agent.

[0050] In this embodiment, the electroless plating method is used to form the conductive film layer 203 on the metal lead 202. Specifically, the bent part of the metal lead 202 is immersed in a chemical solution, such as Figure 6 A schematic diagram showing a bent portion of a metal lead immersed in a chemical solution. Preferably, the metal leads may be fully immersed in the chemical solution. ...

Embodiment 3

[0063] refer to Figure 4 , shows a flexible display provided by an embodiment of the present invention. The flexible display includes a flexible substrate 201 and metal leads 202 formed on the flexible substrate 201, and the metal leads 202 can be bent along with the flexible substrate 201;

[0064] A conductive film layer 203 is formed on the outer surface of the metal lead 202 , and the conductive film 203 layer covers at least the bendable portion of the metal lead 201 .

[0065] In a preferred embodiment of the present invention, the conductive film layer 203 completely covers the outer surface of the metal lead 204 .

[0066] In a preferred embodiment of the present invention, the thickness of the conductive film layer 203 is 0.2 μm˜10 μm.

[0067] In a preferred embodiment of the present invention, the conductive film layer 203 is a metal or an alloy selected from nickel, gold, silver, tin and copper.

[0068] To sum up, in the embodiment of the present invention, th...

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Abstract

The invention provides a preparation method of a flexible display, the flexible display and display equipment. The method comprises the following steps: forming a metal lead on a flexible substrate; bending the flexible substrate and the metal lead; and forming a conductive film layer on the metal lead, wherein the conductive film layer at least covers the part, which is bent, of the metal lead. The conductive film layer, which is formed on the bent part of the metal lead, can still implement electric conduction even though the metal lead becomes bent and cracked, so that such problems as an open circuit, equipment failure and the like caused by cracking of the metal lead are prevented; border dimension of the display equipment are reduced; and meanwhile, reliability of the display equipment is improved.

Description

technical field [0001] The invention relates to the technical field of TFT-LCD, in particular to a preparation method of a flexible display, a flexible display and a display device. Background technique [0002] Thinning is one of people's needs for electronic products, and the size and weight design of display devices is an important consideration in the manufacturing process of electronic devices. Reducing the bezel of the display device or even making it bezel-less can greatly improve the attractiveness of the display device. For flexible display products, due to their bendable characteristics, it is currently a common practice to bend the edge of the lower frame back to the back to reduce the size of the lower frame. However, a significant problem with this technology is that the material in the bending area is prone to cracks and cracks extend during the manufacturing and use process, resulting in a decrease in the reliability of the display device and even failure of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30G02F1/1333
CPCG02F1/1333G09F9/301G02F1/133305G02F1/1362G02F2202/16
Inventor 刘政
Owner BOE TECH GRP CO LTD