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Electronic component supply device, reel device, tape processing device, and component storage tape replenishment method

A technology of electronic components and processing devices, which is applied in the direction of electrical components, electrical components, etc., and can solve problems such as poor extraction of components and deviation of extraction positions

Active Publication Date: 2019-11-15
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, due to this replacement work, the installation position of the exposed part of the electronic component, that is, the removal position of the electronic component may also be shifted.
As a result, during the extraction operation of electronic components by the component mounting head, component extraction failure may occur or the extraction position of electronic components may need to be taught to the system again.

Method used

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  • Electronic component supply device, reel device, tape processing device, and component storage tape replenishment method
  • Electronic component supply device, reel device, tape processing device, and component storage tape replenishment method
  • Electronic component supply device, reel device, tape processing device, and component storage tape replenishment method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0046] figure 1It is a plan view showing the structure of the component mounting device 50 to which the electronic component supply device 1 according to the first embodiment of the present invention is applied. Such as figure 1 As shown, the component mounting device 50 mounts electronic components 105 on a substrate 52 (refer to figure 2 ) to manufacture electronic circuit substrates.

[0047] Specifically, the component mounting apparatus 50 automatically mounts (mounts) the electronic component 105 on a predetermined position (position where solder paste is applied) on the substrate 52 conveyed by the substrate conveying conveyor 51 . A circuit pattern of copper foil or the like is formed by etching, printing, or the like on the substrate 52 formed of epoxy resin or the like.

[0048] The substrate 52 on which the electronic component 105 is mounted on the solder paste is heated in a furnace (not shown) in a subsequent process. Accordingly, the electronic component 10...

no. 2 approach

[0116] Below, refer to Figure 20 ~ Figure 21 , the second embodiment of the present invention will be described focusing on points different from the first embodiment described above, and the description of common points will be omitted. Figure 20 It is a figure for demonstrating the structure of the electronic component supply apparatus 1a in the state which attached the tape processing apparatus 3a to the reel apparatus 2 in 2nd Embodiment of this invention. Figure 21 It is a figure for demonstrating the structure of the reel apparatus 2a concerning 2nd Embodiment.

[0117] The second embodiment of the present invention and Figure 4 The first embodiment shown is different in that the tape processing device 3a includes a first control board 6a for controlling the downstream motor 4 and the like, and the reel device 2a includes a second control board 10 for controlling the upstream motor 5 and the like.

[0118] According to this second embodiment, the second control boa...

no. 3 approach

[0120] Below, refer to Figure 22 ~ Figure 24 , the third embodiment of the present invention will be described focusing on points different from the first embodiment described above, and the description of common points will be omitted. Figure 22 It is a figure for demonstrating the structure of the electronic component supply apparatus 1b in the state which attached the tape processing apparatus 3b to the reel apparatus 2b in 3rd Embodiment of this invention. Figure 23 It is a figure for demonstrating the structure of the tape processing apparatus 3b concerning 3rd Embodiment. Figure 24 It is a figure for demonstrating the structure of the reel apparatus 2b concerning 3rd Embodiment.

[0121] The third embodiment of the present invention and Figure 4 The first embodiment shown is different in that the tape processing device 3 b includes an upstream motor 5 and a downstream motor 4 . That is, a motor for supplying a driving force for conveying the component storage tap...

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Abstract

Electronic component feeding device (1) includes a reeling device (2) and a tape processing device (3). The reeling device (2) has a tape reel (8) wrapped with a storage electronic element (105) of the element storage tape (100). The tape processing device (3) having the electronic element (105) of the element storage tape conveyed from the reeling device (2) is exposed from the element storage tape, so that the electronic component can be removed (18). The reeling device (2) is capable of loading and disassembling the tape processing device (3).

Description

technical field [0001] The present invention relates to an electronic component supply device, a reel device, a tape processing device, and a component storage tape replenishment method, and relates to an electronic component supply device suitable for a component mounting device that mounts electronic components on a substrate to manufacture an electronic circuit board, for example. Background technique [0002] The electronic component supply device is used in a component mounting device (mounter) that manufactures an electronic circuit board by mounting electronic components on a board on which a circuit pattern is formed. This electronic component supply device is used to supply electronic components to be mounted on a substrate. Since the component mounting apparatus handles various electronic components, the electronic component supply apparatus is equipped with a plurality of electronic components corresponding to the electronic components handled by the component mou...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02
CPCH05K13/0419H05K13/086B65H75/32B65H75/4486H05K13/021B65H2701/37
Inventor 池田裕
Owner YAMAHA MOTOR CO LTD