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Laser scribing device

A laser scribing and laser beam technology, applied in laser welding equipment, welding/welding/cutting items, manufacturing tools, etc., can solve problems such as low response speed, difficulty in launching laser beams to accurate points, and difficulty in increasing substrate cutting speed , to achieve high responsiveness

Inactive Publication Date: 2017-09-01
TOP ENG CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0007] However, this configuration in the related art mechanically controls the height of the emitting device for emitting the laser beam, and has the disadvantage of low response speed, making it difficult to increase the cutting speed of the substrate.
One disadvantage is that it is difficult to launch the laser beam to the exact point (position) if the substrate cutting speed increases

Method used

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Embodiment Construction

[0025] Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. First, regarding the reference numerals denoting constituent elements in the respective views, it should be noted that even if the same constituent elements are shown in different drawings, they will be denoted by the same reference numerals. Also, in describing the present invention below, if it is considered that a detailed description of well-known configurations or functions contained herein may make the subject matter of the present invention unclear, the description will be omitted. Also, an exemplary embodiment of the present invention will be described below, but the technical gist of the present invention is not limited to the embodiment, but can be modified and implemented in various ways by those skilled in the art.

[0026] figure 1 is a view showing a laser scribing apparatus according to a first exemplary embodiment of the present ...

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Abstract

The invention relates to a laser scribing device capable of easily changing the focal length of a laser beam when using the laser beam to cut a brittle material substrate. The invention provides a laser scribing device, which is used for performing scribing operation on the substrate by emitting a laser beam on the substrate, comprising a laser source which generates a laser beam; and a laser emission unit for receiving the laser beam from the laser source and emitting the laser beam on the substrate, wherein the laser beam emission unit comprises an optical element which changes the focal length of the laser beam emitted on the substrate.

Description

technical field [0001] The invention relates to a laser scribing device. More particularly, the present invention relates to a laser scribing apparatus capable of easily changing the focal length of a laser beam when cutting a brittle material substrate using the laser beam. Background technique [0002] In some cases, by using a method of cutting an object, a laser beam is used to precisely cut the object to be cut. This method of cutting objects by using a laser beam is also used to cut brittle materials such as plates made of glass and metal materials. [0003] As one example, a panel for a flat panel display such as a liquid crystal display device is cut by using a laser beam. In the related art, a dicing device for cutting liquid crystal display devices cuts a substrate by pressing a dicing wheel made of diamond or hard metal against the surface of the substrate with a predetermined pressure, and then rotating and moving the dicing wheel. wheel to form scribe lines o...

Claims

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Application Information

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IPC IPC(8): B23K26/364B23K26/402B23K26/046
CPCB23K26/046B23K26/364B23K26/402B23K2103/50B23K26/0643B23K26/0648B23K26/38
Inventor 金埈煐
Owner TOP ENG CO LTD
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