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Fingerprint sensing package module and manufacturing method thereof

A manufacturing method, fingerprint technology, applied in the direction of acquiring/arranging fingerprints/palmprints, semiconductor/solid-state device manufacturing, character and pattern recognition, etc., can solve the problems of thick, difficult, and reduce the overall thickness of electronic devices, etc.

Inactive Publication Date: 2017-09-05
MOREVALUED TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this will make the overall volume of the packaging module large and thick, so it is not easy to further reduce the overall thickness of the electronic device

Method used

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  • Fingerprint sensing package module and manufacturing method thereof
  • Fingerprint sensing package module and manufacturing method thereof
  • Fingerprint sensing package module and manufacturing method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] Figure 1A It is a schematic structural diagram of a fingerprint sensing package module according to the first embodiment of the present invention. Figure 1B It is a schematic partial top view of the fingerprint sensing package module according to the first embodiment of the present invention. See Figure 1A and Figure 1B The fingerprint sensing package module 100 includes a cover layer 110, an adhesive layer 120, a circuit board 130, a fingerprint sensing chip 140, a conductive pattern layer 150, and a package body 160. The adhesive layer 120 is located on the cover layer 110. The circuit board 130 is attached to the cover layer 110 through the adhesive layer 120 and has a slot H1. The fingerprint sensor chip 140 is received in the slot H1. The conductive pattern layer 150 is electrically connected to the fingerprint sensor chip 140 and the circuit board 130. The package body 160 is disposed in the slot H1 and covers the fingerprint sensor chip 140.

[0014] The coveri...

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PUM

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Abstract

A fingerprint sensing package module comprises a cover layer, an adhesion layer, a circuit board, a fingerprint sensing wafer, a conductive pattern layer, and a package body. The adhesion layer is positioned on the cover layer. The circuit board has a first surface, and comprises a plurality of pads on the first surface. The first surface of the circuit board is arranged on the cover layer through the adhesion layer. The circuit board has at least one slot. The fingerprint sensing wafer has a sensing surface, and comprises a plurality of contacts on the sensing surface. The sensing surface of the fingerprint sensing wafer is arranged on the cover layer through the adhesion layer and accommodated in the slot. The conductive pattern layer is positioned on the first surface and the sensing surface to electrically connect the pads and the contacts. The package body is at least partially positioned within the slot to cover the fingerprint sensing wafer.

Description

Technical field [0001] A fingerprint sensing package module and a manufacturing method thereof, in particular to a fingerprint sensing package module with a covering layer. Background technique [0002] With the development of technology, electronic devices such as mobile phones, personal laptops or tablets have become essential tools in life. The information stored in these electronic systems, such as address books, photos, etc., is increasing day by day, and they have become quite personal. The characteristics of. In order to avoid the loss or misappropriation of important information, fingerprint sensing package modules are now widely used in electronic devices. [0003] At present, a common fingerprint sensing package module is to electrically connect the fingerprint sensing chip to the circuit substrate through wire bonding, and then cover it with a packaging material. Generally speaking, in the packaging process, the thickness of the packaging material must be higher than t...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L21/56H01L21/60G06K9/00
CPCH01L24/80H01L24/97H01L21/561H01L21/568H01L23/3121G06V40/12H01L2224/97H01L2224/19H01L2224/24227
Inventor 林炜挺郭师群
Owner MOREVALUED TECHNOLOGY CO LTD