Method for bonding vacuum thermal insulation plate, method for preparing refrigeration equipment and refrigeration equipment

Abstract

The invention provides a method for bonding a vacuum thermal insulation plate, a method for preparing refrigeration equipment and the refrigeration equipment. The method for bonding the vacuum thermal insulation plate comprises the following steps: foaming glue is sprayed on the nonplanar surface of a workpiece to be treated; the vacuum thermal insulation plate is put on one side, far from the nonplanar surface of the workpiece to be treated, of the foaming glue; and the pressure perpendicular to the nonplanar surface is applied to the vacuum thermal insulation plate. The method can quickly and effectively bond the vacuum thermal insulation plate on the nonplanar surface, has no need to change the surface shape of a VIP plate, prevents preparation of a special-shaped VIP plate, reduces the use cost of the VIP plate, and prolongs the service life of the VIP plate.

Description

technical field [0001] The invention relates to the technical field of refrigeration, in particular to a method for pasting vacuum insulation panels, a method for preparing refrigeration equipment and refrigeration equipment. Background technique [0002] At present, the application of vacuum insulation panels (VIP panels) in refrigerators / freezers is divided into the following methods. One is to change the surface shape of VIP panels and make slotted VIP panels (refer to figure 1 ), match the channel on the surface of the VIP plate with the size of the condenser. The disadvantages of this method are: 1. The channel of the VIP board needs to match the size and structure of the condenser. Different channels need to be opened for different shapes of condensers, which increases the complexity of the manufacturing process of the VIP board; 2. After the VIP board is packaged and formed 3. The packaging film at the channel of the slotted VIP board will produce a large number of w...

AI Technical Summary

Problems solved by technology

The disadvantages of this method are: 1. The channel of the VIP board needs to match the size and structure of the condenser. Different channels need to be opened for different shapes of condensers, which increases the complexity of the manufacturing process of the VIP board; 2. After the VIP board is packaged and formed 3. The packaging film at the channel of the slotted VIP board will produce a large number of wrinkles due to stress concentration, destroying the film structure of the film, resulting in a decrease in the gas and moisture barrier properties of the film, thus Shorten the service life of the VIP board

The disadvantage of this method is that the size of the space between the support card and the outer wall of the box and between the support card and the support card is inconsistent, and the fluidity of the foam material in this area is limited, resulting in cavitation and uneven foam density....

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