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Mylar punching technology

A Mylar sheet and punching technology, which is applied in metal processing and other directions, can solve the problems of flanging and the thickness of Mylar sheet does not meet the requirements of use, and achieve the effect of meeting the requirements of use.

Inactive Publication Date: 2017-09-22
SUZHOU ANJIE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, after the existing Mylar sheet is punched, there is often a problem of flanging at the edge of the hole structure formed by punching, which will cause the thickness of the Mylar sheet to not meet the requirements for use.

Method used

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  • Mylar punching technology
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Embodiment Construction

[0022] The present invention will be described in detail below in conjunction with the implementations shown in the drawings, but it should be noted that these implementations are not limitations of the present invention, and those of ordinary skill in the art based on the functions, methods, or structural changes made by these implementations Equivalent transformations or substitutions all fall within the protection scope of the present invention.

[0023] Such as figure 1 As shown, the Mylar sheet punching process of the present invention is suitable for a Mylar sheet with the following structure, which includes sequentially stacked: a surface layer 1, a first film structure layer 2, a second film structure layer 3, a protective layer Layer 4. Wherein, the function of the protective layer 4 is to protect the second film structure layer 3 , however, it is not necessary after being applied in electronic products. At the same time, in the punching process, due to the soft tex...

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Abstract

The invention provides a mylar punching technology. A mylar comprises a surface layer, a first film structural layer, a second film structural layer and a protective layer which are sequentially arranged in a stack-up mode. The mylar punching technology is characterized in that the mylar punching technology comprises the following steps that S1, material-incoming is conducted, loading is conducted on the mylar which needs to be punched, and the mylar is conveyed to a material-stripping station along with a guiding roller; S2, material-stripping is conducted, the protective layer at the bottom of the conveyed mylar is stripped, the stripped protective layer is whirled away along with a waste-discharging roller, and the mylar after being stripped is conveyed to a punching station continuously along with the guiding roller; and S3, punching is conducted, and punching is conducted on the corresponding position of the mylar after being stripped through a punching cutting mould. According to the mylar punching technology, the unessential protective layer of the mylar is removed before punching is conducted, so that the problem that after the mylar is punched, flanging occurs is solved, and the using requirements for the mylar of electronic products are met.

Description

technical field [0001] The invention relates to the technical field of production and processing of Mylar sheets, in particular to a punching process capable of preventing flanging during the punching process of Mylar sheets. Background technique [0002] Currently, in electronic products, functional composite tapes are required. The above-mentioned composite adhesive tape generally has functions such as electric conduction, heat conduction, and light shielding according to different materials. Mylar sheet is one of the above-mentioned composite tapes, which is composed of different film structures. Before the Mylar sheet is used, it is usually necessary to punch the Mylar sheet to meet the structural requirements. However, after the existing Mylar sheet is punched, there is often a problem of flanging at the edge of the hole structure formed by punching, which will cause the thickness of the Mylar sheet to fail to meet the requirements for use. [0003] In view of this, ...

Claims

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Application Information

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IPC IPC(8): B26F1/02B26D7/00
CPCB26F1/02B26D7/00
Inventor 王春生贾志江徐鑫唐界斌
Owner SUZHOU ANJIE TECH