Self-extinguishing and high-light reflection epoxy moulding compound and preparation method thereof

An epoxy molding compound, high light reflection technology, applied in the field of polymer material encapsulation of optoelectronic devices, can solve the problems of high epoxy value, high hydroxyl content of cured products, high water absorption, etc. Small, highly fluid effects

Inactive Publication Date: 2017-09-22
SOUTH CHINA UNIV OF TECH
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy value of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate is high, the cured product has a high hydroxyl content and a high water absorption rate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Self-extinguishing and high-light reflection epoxy moulding compound and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] (1) Take 60 parts by mass of cycloaliphatic epoxy resin R3 and heat it to 100°C, add 40 parts by mass of nitrogen-heterocyclic epoxy resin R1, and stir slowly until the nitrogen-heterocyclic epoxy resin R1 is completely dissolved to make resin R3 / resin R1 is a 60 / 40 mixed epoxy resin liquid;

[0043] (2) Take 95 parts by mass of methylhexahydrophthalic anhydride, heat to 40°C, add 0.4 parts by mass of triphenylphosphine, 2 parts by mass of silane coupling agent, and 0.5 parts by mass of benzotriazole UV absorber and 0.5 parts by mass of hindered amine light stabilizer, stirred until triphenylphosphine was dissolved to obtain methyl hexahydrophthalic anhydride solution;

[0044] (3) Transfer the mixed epoxy resin liquid and methyl hexahydrophthalic anhydride solution to a vacuum mixer, slowly add 30 parts by mass of titanium dioxide and 2 parts by mass of polyethylene wax powder at 50°C, and stir for 5 minutes; slowly add 350 parts by mass of spherical silica powder, st...

Embodiment 2

[0051] (1) Take 70 parts by mass of cycloaliphatic epoxy resin R3 and heat it to 100°C, add 30 parts by mass of nitrogen-heterocyclic epoxy resin R1, and stir slowly until the nitrogen-heterocyclic epoxy resin R1 is completely dissolved to make resin R3 / resin R1 is a 70 / 30 mixed epoxy resin liquid;

[0052] (2) Take 95 parts by mass of methylhexahydrophthalic anhydride, heat to 40°C, add 0.4 parts by mass of triphenylphosphine and 2 parts by mass of silane coupling agent, and 0.8 parts by mass of benzotriazole UV absorber and 0.5 parts by mass of hindered amine light stabilizer, stirred until triphenylphosphine was dissolved to obtain methyl hexahydrophthalic anhydride solution;

[0053] (3) Transfer the mixed epoxy resin liquid and methyl hexahydrophthalic anhydride solution to a vacuum mixer, slowly add 10 parts by mass of titanium dioxide, 30 parts by mass of zinc oxide, and 2 parts by mass of polyethylene wax powder at 50 ° C, Stir for 5 minutes; slowly add 350 parts by m...

Embodiment 3

[0060] (1) Take 75 parts by mass of cycloaliphatic epoxy resin R3 and heat it to 90°C, add 25 parts by mass of nitrogen-heterocyclic epoxy resin R1, and stir slowly until the nitrogen-heterocyclic epoxy resin R1 is completely dissolved to make resin R3 / resin R1 is 75 / 25 mixed epoxy resin liquid;

[0061] (2) Take 95 parts by mass of methylhexahydrophthalic anhydride, heat to 40°C, add 0.4 parts by mass of triphenylphosphine and 2 parts by mass of silane coupling agent, and 0.8 parts by mass of benzotriazole UV absorber and 0.5 parts by mass of hindered amine light stabilizer, stirred until triphenylphosphine was dissolved to obtain methyl hexahydrophthalic anhydride solution;

[0062] (3) Transfer the mixed epoxy resin liquid and methyl hexahydrophthalic anhydride solution to a vacuum mixer, slowly add 10 parts by mass of titanium dioxide, 30 parts by mass of zinc oxide, and 2 parts by mass of polyethylene wax powder at 50 ° C, Stir for 5 minutes, slowly add 300 parts by mass...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
water absorptionaaaaaaaaaa
reflectanceaaaaaaaaaa
Login to view more

Abstract

The invention discloses a self-extinguishing and high-light reflection epoxy moulding compound and a preparation method thereof. The epoxy moulding compound is prepared by dissolving solid nitrogenous heterocyclic epoxy resin into liquid alicyclic epoxy resin to form liquid mixed epoxy resin and then mixing with an anhydride curing agent, a curing accelerator, a white pigment, a filler, a silane coupling agent, a demoulding agent and other auxiliary agents in a vacuum mixer. Through thermocuring of the epoxy moulding compound, a self-extinguishing material with the balanced water absorption rate being lower than or equal to 0.6% and the reflectivity being higher than or equal to 90% can be obtained; the epoxy moulding compound has excellent high temperature yellowing resistance and UV aging resistance and good adhesive sealing performance; defects of the light-reflective moulding compound including the conventional LED support can be effectively overcome.

Description

technical field [0001] The invention relates to the technical field of polymer material packaging for optoelectronic devices, in particular to a self-extinguishing high-light reflection epoxy molding compound and a preparation method thereof. Background technique [0002] LED is a new type of light source that is emerging. It not only has high electro-optical conversion efficiency, but also has long service life and high safety and reliability. In the production of LED light sources, in order to improve the external quantum efficiency of packaged LED chips and control the projection direction of radiation, and make full use of the radiant energy released by LEDs, light reflection components are usually arranged around the LED chips. When producing packaged LED chips for surface assembly with lead frames, plastic cups that reflect the radiation of LED chips are prefabricated on the lead frames to make LED brackets. [0003] The reflective cup on the traditional LED bracket ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/06C08L23/06C08K13/04C08K3/22C08K7/18C08K3/36C08K5/3417C08G59/24C08G59/38
CPCC08L63/00C08G59/24C08G59/38C08K2003/2241C08K2003/2296C08L2201/02C08L2201/08C08L2203/206C08L2205/02C08L2205/03C08L63/06C08L23/06C08K13/04C08K3/22C08K7/18C08K3/36C08K5/3417
Inventor 李建雄刘安华崔跃飞潘日辉
Owner SOUTH CHINA UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap