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Manufacturing method of display screen, display screen and display device

A production method and technology for a display screen, applied in the field of display screen, can solve the problems such as the inability to satisfy the accuracy and reliability of punching, the difficulty of punching, etc.

Inactive Publication Date: 2019-07-05
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a display screen manufacturing method, a display screen and a display device to solve the problem that punching holes on the display screen in the prior art is difficult, and the accuracy and reliability of the punching cannot be satisfied.

Method used

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  • Manufacturing method of display screen, display screen and display device
  • Manufacturing method of display screen, display screen and display device
  • Manufacturing method of display screen, display screen and display device

Examples

Experimental program
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no. 1 example

[0027] The first embodiment of the present invention discloses a display screen manufacturing method. Such as figure 1 As shown, the method includes the following steps:

[0028] Step S101: Fabricate a first substrate, and reserve at least one first hole area on the first substrate.

[0029] The first substrate may be an array substrate. The first hole area corresponds to the position of the functional element. For example, camera, receiver, HOME (main page) key and so on.

[0030] Step S102: Fabricate a second substrate, and reserve at least one second hole area on the second substrate.

[0031] The second substrate may be a color filter substrate. The second hole area corresponds to the position of the functional element. For example, camera, receiver, HOME (main page) key and so on.

[0032] Step S103: Drop liquid crystal on the first substrate or the second substrate, and align the first substrate and the second substrate so that the first hole area faces the second...

no. 2 example

[0039] The second embodiment of the present invention discloses a display screen manufacturing method. The method for making a display screen is used for making a flexible screen. Such as figure 2 As shown, the method includes the following steps:

[0040] Step S201: providing a first carrier glass.

[0041] Such as image 3 As shown in (a), a first carrier glass 301 is provided.

[0042] Step S202: Reserve at least one first hole area on the first carrier glass.

[0043] Such as image 3 As shown in (b), a first hole area 302 is reserved on the first carrier glass 301 . The position of the first hole area 302 on the first carrier glass 301 corresponds to the position of the required functional module.

[0044] Step S203: making a first hole definition layer on the first carrier glass.

[0045] Such as image 3 As shown in (c), the first hole definition layer 303 is fabricated on the first carrier glass 301 such that the first hole definition layer 303 covers the fir...

no. 3 example

[0082] The third embodiment of the present invention discloses a display screen manufacturing method. The manufacturing method of the display screen is used for making a rigid screen. Such as Figure 4 As shown, the method includes the following steps:

[0083] Step S401: Reserve at least one first hole area on the first substrate.

[0084] Such as Figure 5 As shown in (a), at least one first hole area 502 is reserved on the first substrate 501 . It should be understood that the first hole region 502 formed in this step is only to reserve the position on the first substrate 501 , rather than to perforate the first substrate 501 .

[0085] Specifically, the first substrate 501 may be an array substrate, and the first substrate 501 includes a thin film transistor array 503 . The TFT array 503 is located outside the first hole area 502 .

[0086] The material of the first substrate 501 is glass.

[0087] Step S402: Reserve at least one second hole area on the second subst...

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Abstract

The invention provides a display screen manufacturing method, a display screen and a display device. The method includes: making a first substrate, and reserving at least one first hole region on the first substrate; making a second substrate, and reserving at least one second hole region on the second substrate; Liquid crystal is dropped on the second substrate, and the first substrate and the second substrate are boxed so that the first hole area faces the second hole area, and the liquid crystal is located on the first substrate except the first hole area or the second hole area. Areas on the substrate other than the second hole area; holes are formed by penetrating the first hole area and the second hole area. By reserving the first hole area and the second hole area on the first substrate and the second substrate respectively, the liquid crystal is not located in the above hole area, and holes are formed in the hole area to meet the accuracy and reliability of punching and avoid liquid crystal Leakage is beneficial to realize full-screen display in which all areas except the perforated area are display areas.

Description

technical field [0001] The invention relates to the technical field of display screens, in particular to a display screen manufacturing method, a display screen and a display device. Background technique [0002] Displays include flexible screens and rigid screens. The flexible screen is, for example, an LCD flexible screen. Rigid screens are, for example, screens used in mobile terminals. Due to the structural requirements of electronic products, for example, the position of the camera of the mobile terminal needs to have a corresponding through hole on the screen, and the position of the receiver needs to have a corresponding receiver hole on the screen; therefore, if you want to make an electronic product with full screen display, then Need to punch holes in the screen. Whether it is a flexible screen or a rigid screen, it is difficult to punch holes, especially micro holes, which cannot meet the accuracy and reliability of punching. Contents of the invention [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/14B28D7/00G02F1/1333
CPCB28D1/14B28D7/00G02F1/1333G02F1/1341G02F2201/56G02F1/133305G02F1/1339G02F1/133354G02F1/133514H01L27/1214
Inventor 冯翔杨照坤张强刘莎孙晓陈延青邱云杨瑞智王涛
Owner BOE TECH GRP CO LTD
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