Ceramic shell for linear array charge-coupled device packaging and manufacturing method thereof
A technology of charge-coupled devices and ceramic shells, which is applied in the fields of electric solid-state devices, semiconductor/solid-state device manufacturing, electrical components, etc. It can solve the problems that one-time molding cannot meet the requirements and high flatness requirements, and achieve large dimensions and airtightness. High, high dynamic range effects
Active Publication Date: 2021-03-23
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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- Claims
- Application Information
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Problems solved by technology
This type of product has high requirements for flatness, and the ceramic parts cannot meet the requirements for one-time molding by high-temperature co-firing process.
Method used
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[0016] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0017] The present invention provides a figure 1 , figure 2 , image 3 The shown ceramic case for packaging a linear array charge-coupled device includes a ceramic part 1 and a dual-in-line lead 3. The chip mounting area 2 of the ceramic part 1 is processed by grinding and polishing, and ceramic blocks 4 at both ends of the ceramic part 1 are welded. The final sealing surface 5 is ground and polished, and after grinding and polishing, the flatness of the ceramic sealing surface 5 and the chip mounting area 2 is both ≤1 μm / mm or 50 μm.
[0018] Further, the sealing surface 5 is ground and polished by a polishing machine; the chip mounting area 2 is ground and polished by a disc-shaped grinding wheel. The sealing surface is preferably polished by a polishing machine, which has high polishing efficiency and good effect, and is conduc...
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Abstract
The invention discloses a ceramic shell for packaging a linear-array charge couple device and a manufacturing method for the ceramic shell, and relates to the technical field of a ceramic packaging shell. The ceramic shell comprises a ceramic part and two columns of direct-insert leads; a chip mounting region of the ceramic part is processed by adopting a grinding and polishing manner; sealing surfaces formed by welding ceramic blocks at the two ends of the ceramic part are grinded and polished; and the flatness of the sealing surfaces and the chip mounting region of the grinded and polished ceramic part are both less than or equal to 1[mu]m / mm or 50[mu]m. The ceramic shell manufactured by the method is high in flatness and airtightness, and can satisfy the requirement of flatness.
Description
technical field [0001] The invention belongs to the technical field of ceramic packaging shells, and in particular relates to a ceramic shell for linear array charge-coupled device packaging and a manufacturing method thereof. Background technique [0002] Conventional CDIP (ceramic dual-in-line package--ceramic dual-in-line package) ceramic shell is composed of ceramic parts, dual-in-line leads and metal sealing ring (optional), among which ceramic parts are made of multi-layer alumina ceramics Tungsten metallized high-temperature co-firing process, one-time molding, no post-processing, and then ceramic parts and leads are assembled and welded with silver-copper solder. [0003] Linear charge coupled device (Charge Couple Device, referred to as CCD) ceramic shell packaging form is a CDIP structure, composed of ceramic parts and dual in-line leads, the ceramic part material is 90% alumina, and the lead material is iron nickel alloy or iron-nickel-cobalt alloy. This type of...
Claims
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IPC IPC(8): H01L27/146H01L27/148H01L21/48
CPCH01L21/4807H01L27/14618H01L27/14806
Inventor 张倩彭博
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP