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Preparation method of chip packaging module set and packaging structure

A chip packaging and chip technology, which is applied in the field of chip packaging module preparation method and packaging structure, can solve the problems of complex process and high technical difficulty of chip packaging technology, and achieve the effect of reducing packaging cost, simplifying process flow and technical difficulty

Inactive Publication Date: 2017-10-20
上海图正信息科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for preparing a chip packaging module and a packaging structure, so as to solve the problems of high technical difficulty and complicated technology of the existing chip packaging process, and achieve the purpose of reducing packaging costs, simplifying the process flow and technical difficulty

Method used

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  • Preparation method of chip packaging module set and packaging structure
  • Preparation method of chip packaging module set and packaging structure
  • Preparation method of chip packaging module set and packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Figure 2A It is a flowchart of a method for preparing a chip packaging module provided in Embodiment 1 of the present invention, Figure 2B-Figure 2F It is a chip packaging module formed in each step of the chip packaging module manufacturing method provided in Embodiment 1 of the present invention. This embodiment is applicable to the case where the surface of the chip in the chip packaging structure is exposed, and specifically includes the following steps:

[0043] Step 110, providing a chip, and a functional circuit is formed on the front side of the chip;

[0044] see Figure 2B , a chip 210 is provided, the front side 211 of the chip 210 is formed with functional circuits.

[0045] Step 120, planting balls on the back of the chip, and the formed solder balls are electrically connected to the functional circuit;

[0046] see Figure 2C , planting balls on the back side 212 of the chip 210 to form solder balls 281, the solder balls 281 are electrically connect...

Embodiment 2

[0069] Figure 3A It is a flow chart of a method for preparing a chip packaging module provided in Embodiment 2 of the present invention; Figure 3B-Figure 3F It is a chip packaging module formed in each step of the chip packaging module manufacturing method provided in Embodiment 2 of the present invention. On the basis of the foregoing examples, optimization is carried out, and the preparation method comprises:

[0070] Step 210, providing a chip, the front side of the chip is formed with a functional circuit;

[0071] see Figure 3B , a chip 310 is provided, the front side 311 of which is formed with functional circuits.

[0072] Step 220, planting balls on the back of the chip, and the formed solder balls are electrically connected to the functional circuit;

[0073] see Figure 3C , planting balls on the back surface 312 of the chip 310 to form solder balls 381 , the solder balls 381 are electrically connected to the functional circuit, specifically, the solder ball ...

Embodiment 3

[0086] Figure 4 A schematic cross-sectional view of a chip packaging module provided in Embodiment 3 of the present invention. This embodiment is applicable to the situation where the surface of the chip is exposed. The specific structure of the chip packaging module 400 is as follows:

[0087] A chip 410, the front 411 of the chip 410 is provided with a functional circuit; the back 412 of the chip 410 is provided with solder balls, and the solder balls are electrically connected to the functional circuit;

[0088] a cover plate 430 attached to the front surface 411 of the chip 410;

[0089] The plastic encapsulation structure 440 is located on the side of the cover plate 430 close to the chip 410 and covers the chip 410;

[0090] The first pad 480 , the first pad 480 is a cross section of the solder ball formed by thinning the plastic package structure 440 and the solder ball, and the package structure exposes the first pad 480 .

[0091] The PCB board 460 , the PCB board ...

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Abstract

The embodiments of the present invention disclose a preparation method of a chip packaging module set and a packaging structure. The method includes the following steps that: a chip is provided, and a functional circuit is formed on the front surface of the chip; balls are planted on the back surface of the chip, so that formed solder balls are electrically connected with the functional circuit; the front surface of the chip is attached to a cover plate; a plastic packaging structure is formed at one side of the cover plate, wherein the one side of the cover plate is adjacent to the chip, and the plastic packaging structure covers the chip; and the solder balls and the plastic packaging structure are thinned, so that first pads can be formed. With the preparation method of the chip packaging module set and the packaging structure provided by the technical schemes of the invention adopted, packaging costs can be decreased, a process flow and technical difficulty can be can be simplified.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of chip packaging, and in particular to a method for preparing a chip packaging module and a packaging structure. Background technique [0002] A cross-sectional schematic diagram of a chip package module as shown in figure 1 As shown, it includes a chip 110 , a package substrate 150 , a PCB board 160 , a cover plate 130 and a filling structure 140 . The front of the chip 110 is directly combined with the cover plate 130 to ensure that the chip 110 has a high penetration rate; the back of the chip 110 is provided with a pad 120 , and is electrically connected to the packaging substrate 150 through the pad 120 . [0003] At present, in order to ensure high chip penetration rate, the chip packaging process adopts the open molding (OpenMolding) scheme, that is, the surface of the chip is exposed and not covered by the filling structure 140 formed by the plastic packaging material, and...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/56H01L23/10H01L23/31
CPCH01L21/50H01L21/56H01L23/10H01L23/3185H01L2224/11
Inventor 刘君周侃
Owner 上海图正信息科技股份有限公司
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