Binding structure of integrated circuit chip and display device

Abstract

The embodiment of the invention provides a binding structure of an integrated circuit chip and a display device, and relates to the technical field of display. The problem can be solved that the contact of signal lines is poor and the display effect is influenced because rolling-up and other deformation occur easily when an existing integrated circuit chip is bound with a substrate panel. The binding structure comprises a substrate and circuit-unit convex blocks, wherein the substrate is provided with a functional area and a virtual area located around the functional area; the circuit-unit convex blocks are distributed on the functional area of the substrate and used for connecting signal lines and transmitting signals. In the process of heating the binding structure of the integrated circuit chip and the display panel or binding the binding structure of the integrated circuit chip and the display panel in a pressurized mode, the virtual area arranged around the functional area can serve as a bound buffering part, rolling-up deformation defects which easily occur at the edge of the binding structure of the integrated circuit chip is limited in the virtual area, and therefore the situation is avoided that the contact of the signal lines is poor because rolling-up deformation defects occur easily to the metal convex blocks of the functional area, and the reliability of the display device is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an integrated circuit chip binding structure and a display device. Background technique [0002] With the continuous development of display technology, large-sized display devices, such as liquid crystal displays, LCD TVs, and flat panel displays, and small and medium-sized electronic products such as mobile phones, digital cameras, etc., are mainly developed based on lightness, thinness, shortness, and smallness. The trend is to improve the comfort of use and facilitate portability. Under this development trend, the chip bonding structure in the display module is required to be high-density and small in size, and to minimize the overall space occupation of the display device while connecting and transmitting input and output signals. [0003] In the existing integrated circuit bonding (Integrated Circuit Bonding, IC Bonding) process, the chip on glass technology (Chip on Glass...

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides an integrated circuit chip binding structure and a display device, which can solve the problem that the existing integrated circuit chip is prone to curling and other deformations when it is bound to the substrate panel, resulting in poor contact of the signal line and affecting the display effect.

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