Heat sink

Abstract

The invention provides a heat sink which is connected with a heating surface of a heating piece. The heat sink includes a bottom surface, a top surface, plural first fins and plural second fins. The plural first fins and the plural second fins are alternately and separately arranged between the top surface and the bottom surface along a specified axis direction. Moreover, plural airflow channels are defined by the plural first fins, the plural second fins, the top surface and the bottom surface collaboratively. The first fin has a first non-overlapped zone and a second non-overlapped zone with respect to a projection area of the second fin along the specified axis direction. The first non-overlapped zone is located at an airflow inlet. In the first non-overlapped zone, the lower portion is wider than the upper portion. The second non-overlapped zone is located at an airflow outlet. In the second non-overlapped zone, the upper portion is wider than the lower portion. The heat sink can improve heat radiating efficiency.

Description

technical field [0001] The present invention relates to a heat dissipation device, in particular to a fin type heat dissipation device. Background technique [0002] With the improvement of the performance of electronic products, various heat dissipation structures or heat dissipation devices applied to electronic products are also flourishing. Among them, the existing common fin type heat dissipation devices have fins that are mostly of the same specification and arranged neatly. The heat dissipation efficiency is still directly proportional to the heat dissipation area of ​​the fins, which does not meet the strict standards that the current heat dissipation device is developing toward lightweight but it is hoped that the heat dissipation efficiency can be further improved. [0003] Another kind of existing fin-type cooling device, such as the Chinese Taiwan New Patent Publication No. M270414 patent invented by the inventor of the present application, is to arrange two kind...

AI Technical Summary

Problems solved by technology

[0002] With the improvement of the performance of electronic products, various heat dissipation structures or heat dissipation devices applied to electronic products are also flourishing. Among them, the existing common fin-type heat dissipation devices have fins that are mostly of the same specification and arranged neatly. The heat dissipation efficiency is still directly proportional to the heat dissipation area of ​​the fins, which no longer meets the strict standards that the current heat dissipation device is developing towards lightweight, but it is hoped that the heat dissipation efficiency can be further improved

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