Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

59results about How to "High heat dissipation coefficient" patented technology

Light emitting diode encapsulation, PCB type radiating substrate used for light emitting diode encapsulation and manufacturing method of PCB type radiating substrate

The invention discloses light emitting diode encapsulation, a PCB type radiating substrate used for the light emitting diode encapsulation and a manufacturing method of the PCB type radiating substrate. The PCB type radiating substrate is formed with a manufacturing method of a PCB and comprises an insulating layer, a first circuit layer and a second circuit layer, wherein the first circuit layer is arranged on the upper surface of the insulating layer and is used for being electrically connected with LED crystal particles through a flip chip or through a wire, the second circuit layer is arranged on the lower surface of the insulating layer, at least one heat conduction hole which penetrates between the upper surface of the insulating layer and the lower surface of the insulating layer is formed in the insulating layer, an electrocoppering layer is arranged on the inner wall of the heat conduction hole and is connected to the first circuit layer and the second circuit layer, and then the radiating coefficient is effectively increased. According to the light emitting diode encapsulation, the PCB type radiating substrate used for the light emitting diode encapsulation and the manufacturing method of the PCB type radiating substrate, the heat conduction hole can be filled with heat conduction materials to further increase the radiating coefficient; the LED crystal particles can be electrically connected to the PCB type radiating substrate through the flip chip or through the wire according to manufacturing requirements to achieve the light emitting diode encapsulation; a bonding layer is arranged outside the second circuit layer to enable the LED encapsulation to be connected to and fixedly arranged on a radiating bracket of an LED light-emitting device to serve as a light source of the LED light emitting device.
Owner:MAO BANG ELECTRONICS

High thermal conductivity heat radiator aluminum profile, preparation method thereof and heat radiator

The invention discloses a preparation method of a high thermal conductivity heat radiator aluminum profile. The preparation method of the high thermal conductivity heat radiator aluminum profile includes: (1) preparing raw material for standby application according to a proportion; (2) performing fusion casting on the raw materials to obtain an aluminum cast rod; (3) squeezing the aluminum cast rod to obtain an aluminum alloy blank body; (4) aligning all parts of the aluminum alloy blank body, wherein alignment rate is 0.8%-3%; (5) straightening the aluminum alloy blank body after being aligned; (6) performing aging treatment on the aluminum alloy blank body after being straightened, and then obtaining the high thermal conductivity heat radiator aluminum profile finished product. Correspondingly, the invention further discloses the high thermal conductivity heat radiator aluminum profile and a heat radiator. By regulating and controlling the formula and process of aluminum alloy, the preparation method of the high thermal conductivity heat radiator aluminum profile reduces lattice distortion, reduces internal stress, and reduces scattering to free electrons, thereby raising the heat conductivity coefficient of the aluminum alloy, and meanwhile guaranteeing good mechanical performance and processing performance.
Owner:GUANGDONG JMA ALUMINUM PROFILE FACTORY GRP +1

Wood drying chamber with flow guiding device

The invention relates to the technical field of solid material drying, and particularly discloses a wood drying chamber with a flow guiding device. The wood drying chamber comprises a box, air heaters, a supporting plate and a flow guiding frame. The flow guiding frame is rotationally connected in the box, flowing guiding plates are circular, the multiple flow guiding plates are rotationally connected to the outer edge of the flow guiding frame, and a spring is connected between the end portion of each flow guiding plate and the flow guiding frame. The two ends of the supporting plate are connected to the inner wall of the box. The supporting plate penetrates the flow guiding frame so that wood on the supporting plate can be located in the middle of the flow guiding frame. The two air heaters are arranged at the upper end and the lower end of the box correspondingly. The facing direction of the air heaters is the outer edge direction of the flow guiding frame, and the wind direction of the two air heaters is the anticlockwise or clockwise rotation direction of the flow guiding frame. Through the rotary flow guiding frame, circulation of high-temperature gas in the box is accelerated, through the arrangement of the flow guiding plates with the changeable angle, distribution of high-temperature airflow around the wood can be more uniform, the situation of serious local heating is avoided, and the wood drying quality is improved.
Owner:CHONGQING KUNXIU DOOR & WINDOW

Preparation process of high-thermal-conductivity extruded aluminum alloy profile

ActiveCN110343884ASimple preparation processOptimizing aging process parametersSolution treatmentHardness
The invention discloses a preparation process of a high-thermal-conductivity extruded aluminum alloy profile. The preparation process comprises the following steps of 1) extrusion, 2) refining, 3) extruding, and 4) effectiveness and the like. An online air cooling technology is adopted, the process of solid solution treatment is omitted, so that the production efficiency is improved; and optimization is carried out on various parameters, especially effective parameters in the preparation process so as to obtain an optimal scheme. According to the preparation process, the formula of the aluminum alloy is improved, the content of Mg and Si in the aluminum alloy component is reduced, Mg / Si ratio is controlled, so that the type of the alloy is in a slightly excess type of Si, and the harmful effect of V is eliminated by adding the boron adding element. On the premise of keeping the hardness, the conductivity of the product is improved. Through verification, the vickers hardness of the product can reach more than 11 Hw or above, the tensile strength is higher than 215 Mpa, the electric conductivity at 20 DEG C is higher than 56% IACS, and the heat conductivity coefficient can reach 220W / mK or above, and all technical parameters reach the world leading level.
Owner:JIANGSU WEITENG COPPER CO LTD

Forced pressure-in-draw-out type turbogenerator ventilation cooling system with multi-wind path interleaving

The invention discloses a forced pressure-in-draw-out type turbogenerator ventilation cooling system with multi-wind path interleaving, which relates to the field of electric machinery. In order to solve the problem of high temperature of a stator iron core, a stator winding and a rotor iron core in an existing turbogenerator, a 'Y'-shaped stator internal air channel is formed in the stator iron core, a stator radial ventilation groove is reserved between the stator iron cores, the stator region is alternately divided into a stator hot air area and a stator cold air area along the axial direction, and the stator iron core is arranged in the stator base; the rotor area is alternately divided into a rotor hot air area and a rotor cold air area along the axial direction, the rotor hot air area and the rotor cold air area are connected through the axial ventilation holes of the rotor, a throw away type fan blade, a rotor first-stage pressurizing fan blade and a rotor second-stage pressurizing fan blade are arranged in the rotor hot air area, a rotor suction fan blade is arranged in the rotor cold air area. The turbine generator has the advantages that the cooling effect of the components of the turbogenerator is enhanced, the structure is simple, and the realization is convenient.
Owner:HARBIN UNIV OF SCI & TECH

Efficient-heat-dissipation integrated LED modulator tube structure and production process thereof

The invention relates to an efficient-heat-dissipation integrated LED modulator tube structure and a production process of the efficient-heat-dissipation integrated LED modulator tube structure. The horizontal wall of an aluminum shell is a packaging plane. A printed circuit layer is arranged on the packaging plane. Chips are welded to the printed circuit layer of the aluminum shell. A silica gel layer is arranged in the area defined by a surrounding glue layer of the aluminum shell. The upper surface of the silica gel layer is evenly coated with a fluorescent powder coating. An intelligent IC drive element is directly welded to the printed circuit layer of the aluminum shell. The two ends of each chip are connected with voltage regulator tubes respectively. The chip-support-aluminum substrate-tube body multistage thermal resistance obstacle is thoroughly omitted, the heat conduction way is improved, and the heat conduction distance is greatly shortened; a support and the aluminum substrate are omitted, and production cost is reduced; the problems that the luminous efficiency is low and the luminous decay becomes large are solved; no extra drive module is needed, and automatic attachment is completed; heat produced when the intelligent IC drive element and electronic elements work is directly transmitted outwards through aluminum pipes, and therefore the heat dissipation effect of a drive module is improved, and the service life of a power supply is prolonged.
Owner:GUANGDONG JINYUAN LIGHTING TECH

A kind of preparation method of aluminum-based graphene, carbon nanotube composite heat dissipation material

The invention relates to a preparing method for an aluminum base graphene and carbon nano tube composite heat dissipation material, and belongs to the technical field of heat dissipation material preparing. The method comprises the steps that equivalent graphene, carbon nano tube powder and aluminum salt are added in an absolute ethyl alcohol solution, and evenly-scattered graphene and carbon nano tube mixed electrophoresis liquid is obtained through ultrasonic scattering; and after being subjected to surface treatment through dilute nitric acid, deionized water, absolute ethyl alcohol and ultrasonic waves, aluminum base sheets serve as a cathode; graphite sheets serve as an anode, and the cathode and the anode are immersed in the mixed electrophoresis liquid to be subjected to electrophoretic deposition; then, the aluminum base sheets are stacked into multiple layers from one end, cold press forming is conducted, the other ends of the aluminum base sheets wrap the outer face of a pressed and formed sample by one circle, and the other ends of the aluminum base sheets are welded and fixed to the side face of the sample; and annealing treatment is conducted at the nitrogen atmosphere, and accordingly the aluminum base graphene and carbon nano tube composite heat dissipation material is obtained. According to the method, the technology is simple, energy saving and environment friendliness are achieved, cost is low, and the prepared composite heat dissipation material is high in heat dissipation efficiency and high in mechanical strength.
Owner:鄂尔多斯市紫荆创新研究院

Switched reluctance motor with water-injected winding and multi-directional self-circulating ventilation system

The invention discloses a switched reluctance motor with a water injection type winding and an axial-radial-circumferential multi-directional self-circulating ventilation system, which belongs to thetechnical field of motors, and aims to solve the problem of high temperature of the existing large-capacity switched reluctance motor. A rotor shaft is mounted on a base through a bearing, a rotor core is mounted on the rotor shaft, a stator core is mounted on the inner wall of the base, a stator copper winding is mounted on the stator core, the rotor core is located in the stator core and a mounting clearance is reserved between the two, a stator direct cooling water pipe is located in the stator copper winding, the two ends of the stator direct cooling water pipe respectively penetrate through the base and are connected to an inlet and an outlet of a direct cooling water driving device, a rotor direct cooling air passage is provided in the rotor core, a stator direct cooling air passageis provided in the stator core, a flaky heat conduction plate is also arranged on the inner wall of the base, and the flaky heat conduction plate corresponds to the stator direct cooling water drivingdevice outside the base. The cooling effect of each component in the large-capacity switched reluctance motor is enhanced, and the switched reluctance motor is simple in structure and convenient to implement.
Owner:HARBIN UNIV OF SCI & TECH

Copper-aluminum different-material cooling plate friction stir tunnel forming method and cooling plate

The invention discloses a copper-aluminum different-material cooling plate friction stir tunnel forming method and a cooling plate. The copper-aluminum different-material cooling plate friction stir tunnel forming method comprises the following steps of selecting a copper alloy plate and an aluminum alloy plate as base materials, and removing oxide layers on the surfaces of the copper alloy plate and the aluminum alloy plate; stacking, clamping and fixing the copper alloy plate and the aluminum alloy plate, taking the copper alloy plate as an upper copper plate of the cooling plate, and taking the aluminum alloy plate as a lower aluminum plate of the cooling plate; starting a main shaft of friction stir welding equipment to drive a stirring head to rotate, so that the stirring head is inserted into the upper copper plate and the lower aluminum plate by a preset depth, and the stirring head keeps rotating; driving the stirring head to horizontally move along a designated welding path to weld the upper copper plate and the lower aluminum plate, so that the cooling plate is obtained; and meanwhile, enabling the stirring head to rotate to enable materials in a weld joint to flow upwards, overflow and deposit on the surface of the weld joint, so that a tunnel is formed in the cooling plate.
Owner:哈工万联智能装备(苏州)有限公司

Preparation process of a high thermal conductivity extruded aluminum alloy profile

ActiveCN110343884BSimple preparation processOptimizing aging process parametersSolution treatmentMaterials science
The invention discloses a preparation process of a high-thermal-conductivity extruded aluminum alloy profile. The preparation process comprises the following steps of 1) extrusion, 2) refining, 3) extruding, and 4) effectiveness and the like. An online air cooling technology is adopted, the process of solid solution treatment is omitted, so that the production efficiency is improved; and optimization is carried out on various parameters, especially effective parameters in the preparation process so as to obtain an optimal scheme. According to the preparation process, the formula of the aluminum alloy is improved, the content of Mg and Si in the aluminum alloy component is reduced, Mg / Si ratio is controlled, so that the type of the alloy is in a slightly excess type of Si, and the harmful effect of V is eliminated by adding the boron adding element. On the premise of keeping the hardness, the conductivity of the product is improved. Through verification, the vickers hardness of the product can reach more than 11 Hw or above, the tensile strength is higher than 215 Mpa, the electric conductivity at 20 DEG C is higher than 56% IACS, and the heat conductivity coefficient can reach 220W / mK or above, and all technical parameters reach the world leading level.
Owner:JIANGSU WEITENG COPPER CO LTD

Alternating-current LED light source

The invention provides an alternating-current LED light source. The alternating-current LED light source comprises a substrate and a plurality of sets of alternating-current LED chips. The substrate plate comprises an aluminum oxide substrate, an insulating layer and a conducting layer which are successively arranged from bottom to top. The substrate further comprises alternating-current LED light source die bonding blocks. The insulating layer is a ceramic insulating layer. The conducting layer is provided with a positive electrode, a negative electrode and serially-connected circuits. The serially-connected circuits are arranged in the die bonding blocks. The insulating layer surrounds the alternating-current LED light source die bonding blocks and is fixed on the aluminum oxide substrate. The serially-connected circuits are electrically connected with the positive electrode and the negative electrode. The plurality of sets of alternating-current LED chips are mutually connected in parallel. Compared with the prior art, the alternating-current LED light source can directly work under an alternating-current power supply, and no internal drive power supply is arranged, so that the material cost and the manual installation cost are substantially saved, the size of the alternating-current LED light source is substantially reduced, and the occupied space is reduced in installation. The aluminum oxide ceramic-based substrate is adopted, the heat dissipation coefficient is high, and the heat stability is good.
Owner:ANHUI ZHANLAN OPTOELECTRONICS TECH

Water leakage preventing stainless steel radiator

The invention relates to a water heating radiator, and belongs to indoor heating devices. A water leakage preventing stainless steel radiator is composed of stretching heat conduction pipes 1, communicated pipes 2, connecting pieces 3, bow-shaped folded edge end sockets 6, a splint bolt 10 and an inner folded edge girth welding part 13, and is characterized in that a rectangle or square is formed by welding the communicated pipes 2 and the connecting pieces 3 at the circular arc faces 14 at the two ends of the stretching heat conduction pipes 1, the stretching heat conduction pipes 1 are connected in series in a communicated mode, the front faces and the back faces of the circular arc faces 14 at the two ends of the stretching heat conduction pipes 1 connected in series in the communicated mode are concaved inwards to form circular arc faces 15, and the middle portions of the front faces and the back faces of the circular arc faces 14 are concaved inwards to form steps 16. The bow-shaped folded edge end sockets 6 are matched with the stretching heat conduction pipes 1 in shape, are inserted into the two ends of the stretching heat conduction pipes and are fixedly connected with an external girth welding part 11. The water leakage preventing stainless steel radiator is characterized in that the cylinder is changed into an inward-concaved cuboid, the heating water area is widened, the heat dissipation area is enlarged, the weight is low, and the water leakage preventing stainless steel radiator is attractive.
Owner:ZAOZHUANG FUYUAN ENVIRONMENTAL PROTECTION & ENERGY SAVING MACHINERY MFG CO LTD

A graphene metal composite multilayer heat sink with high thermal conductivity and preparation method thereof

The invention discloses a high-heat-conduction-performance graphene metal composite multi-layer radiator and a preparing method thereof, and belongs to the technical field of heat dissipation. The radiator comprises a metal base layer, a graphene film layer evenly deposited on the surface of the metal base layer, and a welding part. The preparing method of the high-heat-conduction-performance graphene metal composite multi-layer radiator comprises the following steps that graphene powder and an additive are added in an absolute ethyl alcohol solution, and evenly-scattered graphene dispersion liquid is obtained through ultrasonic scattering; equal-thickness strip-shaped metal sheets are adopted and subjected to surface treatment through dilute nitric acid, deionized water, absolute ethyl alcohol and ultrasonic waves, and then the equal-thickness strip-shaped metal sheets serve as a cathode; the cathode and an anode are jointly immersed in the graphene dispersion liquid to be subjected to electrophoretic deposition; then after the metal base layer is tightly rolled into a multi-layer cylinder from one end, the other end of the metal base layer is welded and fixed to the outer side of the cylinder to be subjected to annealing treatment, and the cake-shaped graphene metal composite multi-layer radiator is formed through cutting in the direction perpendicular to the axial direction of the cylinder. The radiator is high in heat dissipation efficiency, the technology is simple, energy saving and environment friendliness are achieved, cost is low, and the heat dissipation efficiency is high.
Owner:鄂尔多斯市紫荆创新研究院

Double-sided microchannel liquid-cooled power semiconductor whole-wafer flat-panel crimp package structure

InactiveCN103367279BAddressing Thermo-Mechanical Fatigue FailuresSolve fatigue failureSemiconductor/solid-state device detailsSolid-state devicesCapacitanceHeat conducting
Provided is a liquid-cooled power semiconductor wafer plate crimping packaging structure with micro channels on double surfaces. The plate crimping packaging structure comprises a power semiconductor wafer, a spring needle, graphite flakes, an emitter electrode metallic sheet, a collector electrode metallic sheet, a top cooling plate, a bottom cooling plate, and a ceramic tube housing. Graphite flakes are pressed on the top surface and the bottom surface of the wafer. The emitter electrode metallic sheet is arranged on the graphite flake to be used as a leading out terminal for leading out the collector electrode of the wafer, while the collector electrode metallic sheet is arranged on the graphite flake to be used as a leading out terminal for leading out the emitter electrode of the wafer. The graphite flakes, the emitter electrode metallic sheet, and the collector electrode metallic sheet are sealed in the ceramic tube housing. The top cooling plate is pressed on the top of the ceramic tube housing, while the bottom cooling plate is pressed on the bottom of the ceramic tube housing. Cooling micro channels are disposed on the top cooling plate and the bottom cooling plate. The spring needle is pressed on the central position of the top cooling plate in order to lead out the gate electrode of the wafer. The plate crimping packaging structure has advantages of achieving connection without leading wires, reducing stray inductance and stray capacitance generated by leading wire bonding, and increasing a current conducting capability, heat conducting capability, an anti-thermal-shock capability, and reliability, and advantages of a small structural size, a high heat dissipating coefficient, a long service life, and an intelligent monitoring function.
Owner:NANJING HIGHSEMI ELECTRIC POWER SCI & TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products