4results about How to "High heat dissipation coefficient" patented technology

The present invention discloses a chip heat sink with high-efficiency heat dissipation performance, comprising: a device body, a fluid groove and a fluid inlet are provided on the device body, a fluid outlet is provided in the fluid groove, the fluid groove is connected to a fluid outflow channel, and the fluid outflow channel is connected to the upper heat dissipation layer of the chip embedded concave surface. A flow velocity baffle and an injection micro-channel are provided on the chip embedded concave surface, and the injection micro-channel is connected to the fluid inflow layer of the lower layer of the chip embedded concave surface. The chip is embedded in the chip embedded concave surface. The fluid groove is a rectangular groove, the chip embedded concave surface is square, the fluid outlet and the fluid inlet are both cylindrical, and the injection micro-channel is cylindrical. The corrosion-resistant metal material used in the device body is copper Cu, silver Ag or gold Au. The chip heat sink with high-efficiency heat dissipation performance provided by the present invention is cooled by liquid, has high heat dissipation efficiency, large heat transfer coefficient, good working stability, and a wide range of applications.

The utility model relates to the flywheel energy storage technical field, and disclose a kind of flywheel energy storage device of reducing power consumption, including upper motor and energy storage mechanism, the upper motor and energy storage mechanism are communicated to form vacuum cavity, the rotating joint of the shaft that the bottom end extends to the inside of energy storage mechanism is connected in the inside of the upper motor, the inside fixedly connected with the sealing cover of the bottom and energy storage mechanism fixed connection of the upper motor, the sealing cover is sleeved in the outside of shaft, the upper motor includes upper casing;This flywheel energy storage device of reducing power consumption can solve the problem of motor temperature rise caused by low heat dissipation coefficient of excitation winding and large rotor eddy current loss, the problem of high self-discharge rate caused by permanent magnet suspension flywheel rotor, the problem of high manufacturing cost caused by winding potting, improve the stability, security in the process of flywheel energy storage system use, reduce flywheel energy storage system cost.

The application provides a composite slot wedge structure for inhibiting rotor eddy current of a two-axis excitation phase modifier and a two-axis excitation motor, and belongs to the technical field of two-axis excitation motors. Compared with a traditional slot wedge structure, the two-axis excitation motor adopts a double-layer composite slot wedge structure of a hard bakelite slot wedge and an aluminum bronze slot wedge, so that the two-axis excitation motor has the damping capacity and the ability of reducing eddy current at the same time, can guarantee the damping and oscillation inhibition capacity of the two-axis excitation motor, and can also run asynchronously with a large slip. The inertia support capacity of the two-axis excitation motor is improved, and the frequency stability of a power system is guaranteed. A multi-branch path ventilation groove is alternately connected by single branches and double branches, the winding heat dissipation area is significantly increased, and the turn conductor heat dissipation coefficient is improved. The stepped auxiliary slot ventilation groove and the unequal outlet diameters of the hard bakelite slot wedge are beneficial to improving the air flow distribution uniformity in each radial ventilation groove and reducing the rotor winding axial thermal imbalance.

This invention relates to the field of phased array radar antenna technology, and more particularly to a highly integrated, miniaturized, high-power, high-efficiency delay microwave T / R assembly. The assembly includes a housing and a PCB (Printed Circuit Board) for functional integration. The PCB is located on the lower left side of the housing, housing a multi-functional MMIC (Multi-Microelectronics Microcontroller) chip manufactured using MCM (Multi-Chip Module) technology. The multi-functional MMIC chip is located on one side of the PCB, and a wave control chip is located on the other side. The technical solution involves using an SMP (Surface Mount Multi-Fold) button RF connector, where the button and circuit board are softly interconnected inside the assembly. Microwave signals within the circuit board are transmitted via vias, resulting in high input / output isolation and preventing loop self-oscillation. This soft-contact interconnection between the button and the circuit board significantly improves the manufacturability of the assembly.