Unlock instant, AI-driven research and patent intelligence for your innovation.
Pouring method of epoxy resin ab glue in jewelry making
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology of epoxy resin and pouring method, applied in epoxy resin glue, jewelry, clothing, etc., can solve the problems of easy formation of bubbles, white spots of jewelry, affecting the appearance, etc.
Inactive Publication Date: 2019-11-15
CHINA UNIV OF GEOSCIENCES (WUHAN)
View PDF4 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
In the related technology, air bubbles are easy to form during the pouring process, causing white spots to form on the jewelry and affecting the appearance
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0019] Refer to attached figure 1 , the embodiment of the present invention provides a kind of pouring method of epoxy resin AB glue in jewelry making, comprises the following steps:
[0020] (1) Weigh component A and component B of epoxy resin AB glue into a clean container, and stir in the same direction at the same time; stirring in the same direction is conducive to the combination of small bubbles generated during the stirring process into larger bubbles and escape;
[0021] Wherein, the weight ratio of component A to component B is 3:1-1.5, and the composition and mass parts of said component A are: 80-100 parts of bisphenol A epoxy resin, 20 parts of bisphenol F epoxy resin ~40 parts, 5~15 parts of nano-scale silica / epoxy polymer toughening agent, 20~60 parts of filler, the composition of the B component is: 90~100 parts of polyetheramine, 5 parts of amino-terminated polyether ~10 parts, accelerator 1~2 parts; stirring time is 30s~60s; too long stirring time will easi...
Embodiment 2
[0027] Refer to attached figure 2 , the embodiment of the present invention provides a kind of pouring method of epoxy resin AB glue in jewelry making, comprises the following steps:
[0028] (1) Weigh components A and B in proportion to a clean container, and stir in the same direction at the same time;
[0029] (2) Put the above mixed AB glue into another clean container, stir and mix evenly in the same direction;
[0030] (3) Take the uniformly mixed AB component and pour or smear it on the jewelry, and use a needle or toothpick to move the air bubbles formed during the pouring or smearing until the air bubbles leave the jewelry surface;
[0031] (4) The jewelry after pouring is solidified at room temperature until it is formed;
[0032] (5) The molded jewelry is baked at a temperature of 250°C to 280°C for 1s to 3s. All the other are the same as embodiment one.
[0033] After the cured jewelry is damp in the environment and forms white spots, it can be baked at high t...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
The invention discloses a pouring method of epoxy resin AB glue in jewelry manufacturing, which comprises the steps of uniformly stirring and mixing a component A and a component B of the epoxy resin AB glue, pouring an obtained mixture on the jewelry or smearing the obtained mixture on the surface; bubbles generated in the pouring or smearing process can be slightly touched by a hand sewing needle or toothpick, then the bubbles can automatically disappear after being removed from the surface of the jewelry, so that the situation that white spots are formed in the molded jewelry is avoided; white spots formed on the cured and molded jewelry due to the factors of humidity and the like can be removed through heating under high temperature; the process is simple and easy to operate, and the problem that the white spots influences the appearance of the jewelry is solved; the epoxy resin AB glue is adopted, so that the dainty and exquisite of the jewelry is enhanced, and the visual effect of the jewelry is improved.
Description
technical field [0001] The invention relates to the technical field of polymer materials, in particular to a pouring method of epoxy resin AB components in jewelry making. Background technique [0002] Epoxy resin adhesive (epoxy resin adhesive) generally refers to the adhesive made of epoxy resin as the main body. The epoxy resin and its diluent and various auxiliary components are called A glue. Large, generally need to be dispersed at a high speed in a stirring disperser. The curing agent part is called B glue, and the viscosity is generally small, so there is no need to use a stirring disperser. pouring. In the related art, air bubbles are easily formed during the pouring process, resulting in the formation of white spots on the jewelry and affecting the appearance. Contents of the invention [0003] In view of this, the embodiment of the present invention provides a casting method of epoxy resin AB glue that can effectively remove air bubbles and white spots in jewe...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.