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High temperature-resistant and high pressure-resistant electronic label

An electronic tag and high-temperature-resistant technology, which is applied in the field of electronic identification, can solve problems such as user loss, electronic tag chip failure, damage, etc., and achieve the effect of reducing losses

Active Publication Date: 2017-11-17
昆山法拉第智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, when the electronic label encounters a high temperature or high pressure environment, the internal electronic label chip is subjected to high temperature or high pressure, which is easy to cause damage, resulting in failure of the electronic label chip and causing losses to users.

Method used

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  • High temperature-resistant and high pressure-resistant electronic label

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Experimental program
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Effect test

Embodiment Construction

[0021] Such as figure 1 As shown, the present invention provides a high-temperature and high-pressure resistant electronic tag, including housings 10 arranged oppositely, and electronic label chips 20 are arranged between the housings 10; A cavity 31 with an opening is arranged inside the high temperature and high pressure block 30 , and the electronic tag chip 20 is arranged inside the cavity 31 .

[0022] In order to make the weight of the electronic tag smaller and at the same time more resistant to high temperature and high pressure, a preferred technical solution is that the high temperature and high pressure resistant block 30 is an airgel.

[0023] In order to reduce the weight of the electronic tag and further increase the high-temperature resistance strength of the electronic tag, a further preferred technical solution is to incorporate titanium dioxide inside the aerogel.

[0024] In order to make the structure of the electronic tag more stable and at the same time ...

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Abstract

The invention belongs to the electronic identification technical field and relates to a high temperature-resistant and high pressure-resistant electronic label. The High-temperature-resistant and high-pressure-resistant electronic label provided by the invention comprises oppositely-arranged shells; and an electronic label chip is arranged between the shells; a high temperature-resistant and high pressure-resistant block is disposed between the shells; a cavity with an opening is formed in the high temperature-resistant and high pressure-resistant block; and the electronic label chip is arranged in the cavity. According to the high temperature-resistant and high pressure-resistant electronic label provided by the invention, the electronic label chip is protected through the high temperature-resistant and high pressure-resistant block, so that the electronic label chip will not be affected or damaged when being subject to high temperature and high pressure impact, and therefore, loss can be decreased.

Description

technical field [0001] The invention belongs to the technical field of electronic identification, and in particular relates to an electronic label capable of withstanding high temperature and high pressure. Background technique [0002] Electronic tags, realized through RFID (Radio Frequency IDentification) technology, are a communication technology that can identify specific targets and read and write related data through radio signals without the need to establish mechanical or optical contact between the identification system and specific targets. It is used in logistics and supply management, manufacturing and assembly, airline luggage handling, animal identification, access control, electronic tickets, automatic road toll collection and other fields. [0003] The structure of the electronic tag generally includes a substrate on which an antenna is provided. The antenna is generally formed by etching a metal layer or metal paste and attached to the substrate. At the same...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/0773
Inventor 刘建新赵志林
Owner 昆山法拉第智能科技有限公司