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A display panel film forming device and method

A technology for display panels and film-forming equipment, which is applied to metal material coating processes, instruments, coatings, etc., and can solve problems such as film thickness and film quality differences

Active Publication Date: 2019-04-05
CHENGDU TIANMA MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a film-forming device and method for a display panel to solve the problem of differences in film thickness and film quality of the film-forming device, and to achieve film-forming consistency at different positions on the entire substrate and between different substrates

Method used

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  • A display panel film forming device and method
  • A display panel film forming device and method
  • A display panel film forming device and method

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Embodiment Construction

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0034] figure 1 It is a schematic structural diagram of a film-forming device for a display panel provided by an embodiment of the present invention. Such as figure 1 As shown, the display panel film forming equipment provided by the embodiment of the present invention includes:

[0035] At least one vacuum chamber 10, each vacuum chamber 10 is formed with a vacuum chamber 101;

[0036] A gas delivery system 11, connected to the vacuum chamber 10, for delivering gas to the vacuum chamber 101;

[0037] The subs...

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Abstract

The embodiment of the invention discloses film-forming equipment and method for a display panel. The film-forming equipment for the display panel comprises at least one vacuum cavity, a gas conveying system, a substrate on which a film is to be formed and a gas velocity regulating device, wherein a vacuum chamber is formed in each vacuum cavity; the gas conveying system is connected with the vacuum cavity, and is used for conveying gas to the vacuum chamber; the substrate on which the film is to be formed is arranged in the vacuum chamber; the gas velocity regulating device is arranged in the vacuum chamber, is positioned on one film-forming side of the substrate on which a film is to be formed, and is kept a certain distance away from the substrate on which a film is to be formed; gas input into the vacuum chamber flows through the gas velocity regulating device, and is used for forming a film on the substrate on which a film is to be formed; the gas velocity regulating device is used for regulating the flow rate of gas flowing through different positions of the gas velocity regulating device. By adopting the film-forming equipment and method in the embodiment of the invention, the problem of difference between the film-forming thickness and film quality of the film-forming equipment is solved, and the film-forming consistency among different positions of a whole substrate and different substrates is realized.

Description

technical field [0001] Embodiments of the present invention relate to the field of display technology, and in particular, to a film forming device and method for a display panel. Background technique [0002] In the field of liquid crystal display technology, plasma chemical vapor deposition equipment (film formation equipment) is often used to deposit film layers on display substrates. The current plasma chemical vapor deposition equipment includes a vacuum chamber formed with a vacuum chamber, an upper electrode and a lower electrode arranged in the vacuum chamber, and the gas to be reacted reaches the upper electrode through the gas inlet on the upper part of the vacuum chamber. The upper electrode is provided with a lot of through holes, so that the gas enters the reaction area from the upper electrode through the through holes, and the upper electrode is connected to the radio frequency power supply to generate plasma; when the gas under a certain pressure passes throug...

Claims

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Application Information

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IPC IPC(8): C23C16/455C23C16/509C23C16/52G02F1/13
CPCC23C16/45589C23C16/5096C23C16/52G02F1/1303
Inventor 华梓同吴勃扈映茹谌文娟王东花邹志杰
Owner CHENGDU TIANMA MICROELECTRONICS