A chip-level cob module and its manufacturing method
A manufacturing method and chip-level technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of different heights of LED chips, achieve uniform light emission, no difference in light color, and prolong service life.
Active Publication Date: 2019-11-15
FUJIAN SUNWISE SEMICON TECH CO LTD
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a chip-level COB module and its manufacturing method, which can solve the problem of inconsistent heights of LED chips, and is resistant to high temperatures and has a long service life
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[0028] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and preferred embodiments.
[0029] figure 1 and 2 A flow chart of the manufacturing method of the chip-level COB module of this embodiment is given, which will be described in detail below with reference to the accompanying drawings.
[0030] Such as figure 1 As shown, a method for manufacturing a chip-level COB module includes:
[0031] S1 Prepare the fluorescent plate: prepare the fluorescent plate for use, wherein the fluorescent plate is a transparent substrate with a fluorescent material on the surface and / or inside, and the transparent substrate is one of a transparent glass substrate, a transparent ceramic substrate or a transparent sapphire substrate One, on which there is at least one chip mounting area for mounting LED chips; the fluor...
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The invention relates to a manufacturing method for a chip-level COB module. The manufacturing method comprises the steps of S1, preparing a fluorescent screen: preparing the fluorescent screen for use, wherein the fluorescent screen comprises a transparent substrate and a fluorescent material; and the fluorescent material is positioned on the surface and / or the interior of the transparent substrate; S2, glue dispensing: dispensing glue on the transparent substrate; S3, LED chip mounting: fixing the LED chip on the fluorescent screen, wherein each LED chip comprises a light emitting layer and an electrode; and in installation, the light emitting layer of the LED chip is connected with the fluorescent screen through glue; and S4, circuit substrate mounting: welding the electrode of the LED chip on the fluorescent screen on the circuit substrate through solder paste. Correspondingly, the invention also provides the chip-level COB module manufactured by the manufacturing method. By virtue of the chip-level COB module, it is fully ensured that all LED chips on the chip-level COB module are uniform and consistent in light emission and uniform in light output; and in addition, the chip-level COB module is free of light color difference, high in temperature resistance and long in service life.
Description
technical field [0001] The invention relates to the technical field of LED packaging, in particular to a chip-level COB module and a manufacturing method thereof. Background technique [0002] With the continuous development of semiconductor lighting technology, the demand for high power density, high power, and flip-chip LEDs is increasing. The traditional COB technology has reached a bottleneck due to the heat dissipation and size of the chip itself and the limitations of the COB structure. When the power density When it is too high, the heat resistance of the silica gel used for packaging has reached the limit, the light decay is too large, the colloid turns yellow, and even the colloid cracks frequently occur, and the service life is short; on the other hand, when making COB modules, usually A single LED chip is welded on the circuit board with solder paste. Due to the slight difference in the amount of solder paste used for soldering, the height of the LED chip is incon...
Claims
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IPC IPC(8): H01L25/075H01L33/00H01L33/48H01L33/50H01L33/62
CPCH01L25/0753H01L33/005H01L33/48H01L33/505H01L33/62H01L2224/73253
Inventor 王孟源曾伟强
Owner FUJIAN SUNWISE SEMICON TECH CO LTD