LED chip with balance electrode and manufacturing method of LED chip

Abstract

The invention discloses an LED chip with a balance electrode. The LED chip comprises a substrate, a light emitting structure arranged on the substrate, an insulating layer, an N electrode and a P electrode, wherein the light emitting structure is etched to a first hole and a second hole of a first semiconductor layer; the first hole and the second hole divide the light emitting structure into a first light emitting structure and a second light emitting structure; the insulating layer is arranged on a reflecting layer of the first light emitting structure and extends to the side wall of the first light emitting structure; the P electrode penetrates through the insulating layer and is arranged on the reflecting layer of the first light emitting structure; the N electrode is arranged on a reflecting layer of the second light emitting structure and extends to the first semiconductor layer along the side wall of the second light emitting structure; and the thickness of the N electrode and the thickness of the P electrode on the reflecting layer are the same. Accordingly, the invention further discloses a manufacturing method of the LED chip with the balance electrode. The N electrode and the P electrode are on the same plane, welding holes between the electrodes and the substrate are prevented, and the welding yield is improved.

Description

technical field [0001] The invention relates to the technical field of light emitting diodes, in particular to an LED chip with balanced electrodes and a manufacturing method thereof. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a semiconductor device that uses carrier recombination to release energy to form light. LED chips have low power consumption, pure chromaticity, long life, small size, fast response time, energy saving and environmental protection, etc. Many advantages. [0003] Compared with front-mounted LED chips, flip-chip LED chips have many advantages such as uniform current distribution, good heat dissipation, lower voltage, and high efficiency. Therefore, after the flip-chip LED chip was proposed, it quickly received widespread attention and made a series of progress. However, compared with the front-mounted LED chip, the flip-chip LED chip needs to use solder paste welding or eutectic welding to solder the chip to the s...

AI Technical Summary

Problems solved by technology

However, compared with the front-mounted LED chip, the flip-chip LED chip needs to use solder paste welding or eutectic welding to solder the chip to the substrate for wiring connection when performing eutectic soldering. Etch the N-type conductive layer and deposit the N electrode metal on it, so there is a height difference of about 1.2 microns between the N electrode and the P electrode. When solder paste welding or eutectic welding is used, the lower N Poor welding voids are prone to occur on electrodes, which affects the reliability of packaged devices

Images