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Fast beam manipulation for cross-axis micromachining

A technology of beam axis and beam deflection, which is applied in the direction of metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of increasing processing time and affecting output, etc.

Active Publication Date: 2017-11-28
ELECTRO SCI IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Figure 1A to Figure 1C It was demonstrated that the trenches 20 may need to be widened at the top surface of the workpiece 10 to achieve the desired depth, thereby increasing processing time and adversely affecting throughput

Method used

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  • Fast beam manipulation for cross-axis micromachining
  • Fast beam manipulation for cross-axis micromachining
  • Fast beam manipulation for cross-axis micromachining

Examples

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Embodiment Construction

[0198] In the following, in conjunction with the drawings and preferred embodiments of the utility model, the technical means adopted by the utility model to achieve the intended purpose of the utility model are further described.

[0199] and Figure 1A to Figure 1C A disadvantage of the related process is that each pass along the beam trajectory is time consuming, thereby increasing the time consumed per workpiece, thereby reducing throughput.

[0200] and Figure 1A to Figure 1C Another disadvantage of the related process is that the power and pulse repetition rate of newer lasers exceed the damage threshold at the maximum available speed of relative motion between the beam axis and the workpiece along the beam trajectory. This problem can be solved by not allowing the full potential of the laser to be used. For example, laser pulses can be attenuated, or a certain number of laser pulses can be blocked. Furthermore, using the highest velocity of relative motion between t...

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PUM

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Abstract

A laser processing system includes a first positioning system (1044) for imparting first relative movement of a beam axis along a beam trajectory (1062) with respect to a workpiece (1060), a processor for determining a second relative movement of the beam axis (1061) along a plurality of dither rows, a second positioning system (1042) for imparting the second relative movement, and a laser source (1046) for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations (5310) one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.

Description

[0001] Cross-reference to related applications [0002] This application is a non-provisional application of US Provisional Patent Application No. 62 / 126,420 filed February 27, 2015, the contents of which are hereby incorporated by reference in their entirety for all purposes. [0003] Copyright Notice [0004] 2016 Electro Scientific Industries, Inc. A portion of the disclosure of this patent document contains material that is protected by copyright. The copyright owner has no objection to the facsimile reproduction by anyone of this patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent files or records, but otherwise reserves all copyright rights. 37 CFR §1.71(d). technical field [0005] This patent is about horizontal axis laser processing. Background technique [0006] Laser processing of dielectric and conductive materials is commonly used to ablate fine features in electronic components. For example, a chip package sub...

Claims

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Application Information

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IPC IPC(8): B23K26/0622B23K26/08B23K26/00B23K26/062B23K26/06B23K26/352
CPCB23K26/0622B23K26/352B23K26/356B23K26/0608B23K26/0648B23K26/36Y02P10/25B23K26/362
Inventor 张海滨杨川马克·艾伦·昂瑞斯马汀·奥瑞克
Owner ELECTRO SCI IND INC
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