A method to predict the wettability of brazing filler metals controlled by low melting point elements

A technology with low melting point and wettability, applied in chemical property prediction, analytical materials, measuring devices, etc., can solve the problems of high cost, low test efficiency, low efficiency, etc., achieve high numerical calculation accuracy and reduce test workload , the effect of reducing the test cost

Active Publication Date: 2019-12-10
NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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  • Summary
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  • Description
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  • Application Information

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Problems solved by technology

Chinese patent 201310040275.3 discloses a method for improving the wettability of solder by combining ultrasonic field and electrostatic field. This patent adopts the process of wetting test, sample photographing, and drawing software calibration to analyze the wetting angle and wetting area, and judge the brazing area. material wettability; although the ultrasonic + electrostatic composite field can effectively improve the solder wettability, but after a large number of wetting tests, sample photographs, and software calibration procedures to determine whether the wettability is good or bad, the process is complicated, the test cost is high, and the efficiency is high. low
The published Chinese patent 201510865787.2 uses an L-shaped or V-shaped base metal plate to test the wettability of the solder by the crawling area or distance (height) of the solder on both sides of the L-shaped or V-shaped base metal, but it needs to be fabricated L-shaped or V-shaped base metal, adding flux, wet heat preservation-cooling, area or distance measurement and other steps, the process procedure is quite complicated, the cost is high, and the test efficiency is very low
Patent CN201410707428.X discloses a method for calculating the wetting speed of Sn-based solder and Cu substrate. The formula of wetting speed is established by means of the relationship between the area of ​​the wetting spot, the effective radius of the wetting spot, and time, but the image acquisition , Establish time-wetting spot area relationship curve, time-wetting spot effective radius relationship curve, the test workload is huge, the accuracy rate is poor, and the calculation efficiency is low

Method used

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  • A method to predict the wettability of brazing filler metals controlled by low melting point elements
  • A method to predict the wettability of brazing filler metals controlled by low melting point elements
  • A method to predict the wettability of brazing filler metals controlled by low melting point elements

Examples

Experimental program
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Embodiment 1

[0025] Example 1: A method for predicting the wettability of Sn-regulated silver solder (AgCuZnSn, Sn content not exceeding 6.5%) on the surface of 304 stainless steel, which includes the following steps:

[0026] Step 1: Use XRF-1800 X-ray fluorescence spectrometer (XRF) to determine the content of Sn in the solder W M % (Mass score);

[0027] Step 2: Use STA449F3 thermal analyzer (DSC) to determine the melting temperature range of solder ΔT M ;

[0028] Step 3: Change the content of the low melting point element W in Step 1 M % Expand 100 times and the melting temperature interval data of step 2 ΔT M Substitute into predictive mathematical model S M .

[0029]

[0030] Since it contains a low melting point element, n=1.

[0031] Step 4: According to Step 3 S M The size of the value determines the law of the influence of Sn element on the wettability of the solder. The smaller the value, the better the wettability of the solder, and vice versa.

[0032] In order to verify the accuracy o...

Embodiment 2

[0035] Example 2: A method for predicting the wettability of In element-regulated silver solder (AgCuZnIn, with an In content of not more than 5.5%) on the surface of 316 stainless steel. The steps are the same as in Example 1.

[0036] The specific data is shown in Table 2 below:

[0037]

[0038] According to Table 2, as the In content increases, the S of AgCuZnIn solder on the surface of 316 stainless steel M The value gradually decreases, indicating that its wettability is getting better and better; the test results show that as the In content increases, the wetting area of ​​the solder gradually increases. The test results are consistent with the predicted results of the present invention.

Embodiment 3

[0039] Embodiment 3: A method for predicting the wettability of a silver solder (AgCuZnGa, Ga content not exceeding 6.5%) on the surface of H62 brass with Ga element regulation, and the steps are the same as in Embodiment 1.

[0040] The specific prediction data and test results are shown in Table 3 below:

[0041]

[0042]

[0043] According to Table 3, with the increase of Ga content, the S of AgCuZnGa solder on the surface of H62 brass M The value gradually decreases, indicating that its wettability is getting better and better; the test results show that as the Ga content increases, the wetting area of ​​the solder gradually increases. The test results are consistent with the predicted results of the present invention.

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Abstract

The invention discloses a method for predicting the wettability of a low melting point element-regulated hard solder. The method comprises the following steps: 1, measuring the contents WM% (mass fraction) of all low melting point elements in the solder; 2, determining the melting temperature range delta TM of the solder; 3, expanding the contents WM%, obtained in the step 1, of the elements having different low melting points by 100 times, respectively substituting data of the melting temperature range delta TM, obtained in the step 2, into a predictive mathematical model SM, and multiplying to obtain the numerical value of the SM; 4, judging the wettability of the solder according to the numerical value of the SM, wherein the smaller the numerical value is, the better the wettability of the solder is, and the higher the numerical value is, the poorer the wettability of the solder is. The method can be used for rapidly efficiently and accurately predicting the wettability of the low melting point element-regulated hard solder by combining the melting temperature range of the low melting point element-containing solder, the contents of the low melting point elements and the predictive mathematical model.

Description

[0001] Technical Field: The present invention belongs to the field of solder performance evaluation, and specifically relates to a method for predicting the wettability of brazing solders with low melting point elements. Background technique: [0002] The wettability is an important index to evaluate the performance of the solder, and its quality directly affects the filling capacity of the solder and the quality and performance of the brazed joint, thereby affecting the service life and reliability of the parts to be brazed. Therefore, solder wettability is one of the key scientific issues in the research of brazing materials. [0003] Low melting point elements (melting point lower than 350°C) have the beneficial effects of lowering the solder melting temperature and improving solder wettability. For brazing filler metals (melting point higher than 450°C), add a certain amount of low melting point elements, It can effectively improve the wettability and filling capacity of the br...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N23/223G01N25/04G16C10/00
CPCG01N23/223G01N25/04G16C20/30
Inventor 王星星杜全斌彭进崔大田孙国元
Owner NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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