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High-speed modular connector

A technology of modularization and connectors, which is applied in the direction of connection, parts of connection devices, contact parts, etc., can solve problems such as difficulty in maintenance and replacement, and achieve the effects of increasing service life, reducing use costs, and improving the ability to resist vibration and shock

Active Publication Date: 2017-12-15
SICHUAN HUAFENG ENTERPRISE GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above-mentioned shortcomings in the prior art, the high-speed modular connector provided by the present invention adopts a modular design for the components for signal transmission, thereby solving the problem of difficult maintenance and replacement

Method used

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Embodiment Construction

[0036] The specific embodiments of the present invention are described below so that those skilled in the art can understand the present invention, but it should be clear that the present invention is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes Within the spirit and scope of the present invention defined and determined by the appended claims, these changes are obvious, and all inventions and creations using the concept of the present invention are included in the protection list.

[0037] refer to Figure 1 to Figure 3 , figure 1 A perspective view of a high-speed modular connector is shown; figure 2 A perspective view of the socket 2 is shown; image 3 An exploded view of socket 2 is shown; as Figure 1 to Figure 3 As shown, the high-speed modular connector includes a plug 1 and a socket 2.

[0038] Such as figure 1 and Figure 4 As shown, the plug 1 includes a plug housing 14, two receiving c...

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Abstract

The invention discloses a high-speed modular connector. A plug comprises a plug shell. At least one accommodating cavity and a plurality of through holes are arranged in the plug shell. A signal pin module is arranged in each accommodating cavity. A socket comprises a socket shell. The number of accommodating grooves therein matching the number of accommodating cavities is arranged in the socket shell. A boss of the socket shell is provided with jacks therein communicating with the accommodating grooves. Each accommodating groove is provided with a signal jack module therein connected with the corresponding signal pin module in a plug-in manner. After the plug and the socket are assembled together, radio frequency connecting members are mounted in the through holes and the jacks communicated with each other. Each signal pin module includes a base and a pin assembly having a plurality of pin blocks. Each base is provided with a plurality of rows of mounting holes. Each pin block is plugged into one row of mounting holes. Each signal jack module comprises a base body having a plurality of plug-in holes and a jack assembly plugged into the plug-in holes. Each jack assembly comprises a plurality of rows of signal jacks. Each row of signal jacks is connected with one pin block in a plug-in manner, and each row of signal jacks is fixedly connected by one fixing block.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a high-speed modular connector. Background technique [0002] With the rapid development of communication and information technology, weapons and equipment are expected to achieve the advantages of integrated multi-function, multi-data transmission, small weight and volume, higher reliability requirements and convenient operation during production. The connectors LRM and JVPX currently used in communication equipment for signal transmission have problems such as large size, heavy weight, low reliability, and inconvenient maintenance and replacement. The details are as follows: [0003] a) In terms of weight reduction and miniaturization: the existing LRM and JVPX have large dimensions, take up a lot of space, and occupy a large area of ​​printed boards (LRM is 2.0mm×2.0mm, JVPX is 1.8mm×1.8mm), and the internal space of the equipment is utilized The rate is limited by the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/15H01R13/506H01R13/514H01R13/627
CPCH01R13/15H01R13/506H01R13/514H01R13/627
Inventor 庞斌刘俊张英钟芸何卫国成章谭继勇刘长江
Owner SICHUAN HUAFENG ENTERPRISE GRP
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