Packaging method and packaging structure of OLED display substrate, and display apparatus

Abstract

The invention provides a packaging method and packaging structure of an OLED display substrate, and a display apparatus, and belongs to the technical field of display. For the packaging method of an OLED display substrate, the OLED display substrate includes a display area, a blocking structure at the edge of the OLED display substrate, and a non-display area which is arranged between the display area and the blocking structure. The packaging method of an OLED display substrate includes the step of printing rheological property organic material in the area enclosed by the blocking structure, and before printing the rheological property organic material, the packaging method also includes the step of processing the surface, for contacting the rheological property organic material, of the OLED display substrate to enable the flowing speed of the rheological property organic material in the non-display area to be less than the threshold The packaging method and packaging structure of an OLED display substrate can realize a narrow frame of the display apparatus.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging method, packaging structure and display device of an OLED display substrate. Background technique [0002] The process steps of the existing flexible OLED packaging structure mainly include: preparing a flexible substrate→making the first gate insulating layer→making the first gate metal layer pattern→making the second gate insulating layer→making the second gate metal layer pattern→making the interlayer Insulation layer→making source-drain metal layer pattern→making flat layer→making anode→making pixel definition layer→making spacer layer→making cathode→making encapsulation film layer, wherein the encapsulation film layer includes organic film and inorganic film stacked, When preparing organic thin films, rheological organic materials, such as acrylic materials, are inkjet printed in the filled area surrounded by barriers. The rheological organic materials solidify ...

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Problems solved by technology

[0002] The process steps of the existing flexible OLED packaging structure mainly include: preparing a flexible substrate→making the first gate insulating layer→making the first gate metal layer pattern→making the second gate insulating layer→making the second gate metal layer pattern→making the interlayer Insulation layer→making source-drain metal layer pattern→making flat layer→making anode→making pixel definition layer→making spacer layer→making cathode→making encapsulation film layer, wherein the encapsulation film layer includes organic film and inorganic film stacked, When preparing organic thin films, rheological organic materials, such as acrylic materials, are inkjet printed in the filled area surrounded by barriers. The rheological organic materials solidify in the filled area to form organic thin films. Since the thickness of the organic thin film is relatively large, therefore , the climbing distance at the edge is relatively large, that is, the distance from the edge of the display area to the barrier is relatively large, which is not conducive to the realization of narrow and borderless display devices

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