Minimum height cmos image sensor

Abstract

The present application relates to a minimum height CMOS image sensor, wherein a CMOS image sensor for a camera assembly is provided having a sensor die with opposing faces, upper and lower. On top, the sensor die is provided with a sensor array, an analog-to-digital conversion module, digital logic circuits, and timing and clock control circuits. The sensor array is basically centered on the sensor die. The analog-to-digital conversion module is divided into two sub-modules. Each sub-module is disposed adjacent to and positioned on opposite sides of the sensor array. Digital logic circuits form the first row. Timing and clock control circuits and analog signal processing circuits are adjacent and form a second row. The first and second rows are of similar size and are disposed on opposite sides of the sensor array.

Description

technical field [0001] The present invention relates to complementary metal oxide semiconductor (CMOS) image sensors. Background technique [0002] In general, the layout of a sensor die for a CMOS image sensor includes a sensor array, an analog-to-digital (ADC) module, digital logic circuits, and a timing and control plane. The sensor array is not centered on the sensor die in order to keep like components together. Optimizing the sensor die layout design to keep similar components together allows several advantages. For example, an ADC module in a conventional image sensor outputs in a line-to-line image digital format, which is compatible with conventional image display devices. However, there are adverse consequences to these layout designs. Sacrifice, for example, centers sensor arrays on the die to keep similar components together. Additionally, the possibility of a smaller footprint for sensors threatens convention by keeping similar components together. This can...

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Problems solved by technology

This can be especially problematic for edge-mounted sensors such as imaging barcode scanners

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