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Load lock apparatus, cooling plate assembly, and electronic device handling system and method

A technology of load-locking and processing systems, applied in the manufacturing of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of intensive, time-consuming, labor-intensive, and troublesome

Active Publication Date: 2021-08-03
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in existing load lock chambers, chamber cleaning of the load lock chamber is time consuming and labor intensive
Additionally, existing load-lock chambers that include stacked load-lock configurations may suffer from heat-related

Method used

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  • Load lock apparatus, cooling plate assembly, and electronic device handling system and method
  • Load lock apparatus, cooling plate assembly, and electronic device handling system and method
  • Load lock apparatus, cooling plate assembly, and electronic device handling system and method

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Embodiment Construction

[0027] In substrate processing, load lock chambers are sometimes used to actively cool substrates exiting a processing chamber coupled to a transfer chamber where the substrates are exposed to high temperatures. The substrate is transferred into a load lock chamber, cooled, and then transferred further through the factory interface via a factory interface robot. In instances where stacked load lock chambers are used (this is for large throughput), existing load lock chamber designs may not provide a suitable thermal environment for both the upper and lower load lock chambers. This may result in uneven cooling between substrates off the top or bottom, or possibly between different cycle times, both of which are undesirable.

[0028] Thus, in a first embodiment, an improved load lock apparatus comprising stacked load lock chambers is provided. The load lock device includes: a load lock body including a lower load lock chamber and an upper load lock chamber; a lower cooling plat...

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PUM

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Abstract

A load lock apparatus including a lower disc diffuser is provided. The load lock apparatus includes a load lock body containing a lower load lock chamber and an upper load lock chamber with a lower cooling plate in the lower load lock chamber and an upper cooling plate in the upper load lock chamber. A lower disc diffuser may be located centrally above the lower cooling plate. An upper disc diffuser may be located centrally above the upper cooling plate. Systems including load lock devices and methods of operating load lock devices are provided. A cold plate assembly is also provided that can be easily removed for cleaning, with many other aspects to follow.

Description

[0001] Related applications [0002] This application claims U.S. Nonprovisional Application Serial No. 14 / , filed April 22, 2015, entitled "Load Lock Apparatus, Cooling Plate Assembly, and Electronic Device Handling System and Method," Docket No. 22367 / USA. 693,386, which is hereby incorporated by reference in its entirety for all purposes. technical field [0003] The present invention relates generally to electronics manufacturing and, more specifically, to load lock apparatus. Background technique [0004] Conventional electronics manufacturing tools may include multiple process chambers and one or more load lock chambers surrounding the transfer chamber. These electronic device manufacturing systems may employ transfer robots that may be housed within transfer chambers and transfer substrates between various processing chambers and one or more load lock chambers. In some examples, load lock chambers may be stacked one on top of the other (eg, dual load locks). [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67201H01L21/67109
Inventor 保罗·B·路透特雷斯·莫瑞
Owner APPLIED MATERIALS INC