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A kind of electroless copper plating bath

A technology of electroless copper plating and plating solution, applied in the field of electroless plating, which can solve the problems of environmental damage, easy volatilization of formaldehyde, etc., and achieve the effects of fine crystallization, high-quality plating, and environmental protection

Active Publication Date: 2019-10-18
XINFENG ZHENGTIANWEI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional electroless copper plating is a process system using formaldehyde as a reducing agent. This process can obtain a better electroless copper plating effect, but because formaldehyde is easy to volatilize, it will cause harm to the human body and the environment.

Method used

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  • A kind of electroless copper plating bath
  • A kind of electroless copper plating bath

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The epoxy resin board was made into a rectangle with a length and width of 4cm×5cm, and the experiment was carried out according to the electroless plating process. In this process, only the content of each substance in the electroless copper plating solution formula was changed, and other conditions were kept unchanged. Copper sulfate pentahydrate is 5g / L, sodium hypophosphite is 35g / L, sodium citrate is 15g / L, boric acid is 25g / L, nickel sulfate hexahydrate is 1g / L, polyvinylpyrrolidone is 24mg / L, diphenylamine The sodium sulfonate is 52mg / L, the pH value is 10, and the temperature is 65°C.

[0019] Through experiments, the surface of the obtained copper coating is light pink and crystallized; the deposition rate is 1.68 μm / h, which meets the requirements of the PCB industry; the plating solution containing composite additives is more stable than the base solution without composite additives. Comparison of electron microscope scanning images of copper plating obtained...

Embodiment 2

[0021] The epoxy resin board was made into a rectangle with a length and width of 4cm×5cm, and the experiment was carried out according to the electroless plating process. In this process, only the content of each substance in the electroless copper plating solution formula was changed, and other conditions were kept unchanged. Copper sulfate pentahydrate is 5g / L, sodium hypophosphite is 25g / L, sodium citrate is 15g / L, boric acid is 25g / L, nickel sulfate hexahydrate is 1g / L, polyvinylpyrrolidone is 24mg / L, diphenylamine The sodium sulfonate is 52mg / L, the pH value is 10, and the temperature is 65°C.

[0022] Through experiments, the surface of the obtained copper plating layer is light pink and fine crystal; the deposition rate is 1.59 μm / h, which meets the requirements of the PCB industry; the plating solution containing composite additives is more stable than the base solution without composite additives.

Embodiment 3

[0024] The epoxy resin board was made into a rectangle with a length and width of 4cm×5cm, and the experiment was carried out according to the electroless plating process. In this process, only the content of each substance in the electroless copper plating solution formula was changed, and other conditions were kept unchanged. Copper sulfate pentahydrate is 5g / L, sodium hypophosphite is 35g / L, sodium citrate is 18g / L, boric acid is 25g / L, nickel sulfate hexahydrate is 1g / L, polyvinylpyrrolidone is 24mg / L, diphenylamine The sodium sulfonate is 52mg / L, the pH value is 10, and the temperature is 65°C.

[0025] Through experiments, the surface of the obtained copper coating is light pink and crystallized; the deposition rate is 1.67 μm / h, which meets the requirements of the PCB industry; the plating solution containing composite additives is more stable than the base solution without composite additives.

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Abstract

The invention relates to a chemical plating technology, in particular to a chemical plating composite additive and a copper plating solution composed of the chemical plating composite additive. The performance of a plating solution and a plating layer in the chemical plating technology can be obviously improved. The composite additive is polyvinylpyrrolidone (K=30) and sodium diphenylamine sulfonate, during use, the polyvinylpyrrolidone (K=30) and the sodium diphenylamine sulfonate are dissolved into deionized water to form a polyvinylpyrrolidone and sodium diphenylamine sulfonate mixed solution with the concentration ranging from 1 g / L to 2 g / L. The plating solution containing the composite additive is more stable than basic liquid which does not contain an additive; it is shown through experiments that crystals of the copper plating layer obtained through the plating solution are exquisite, and the quality of the plating layer is high; and the plating solution does no harm to the human body and the environment, and environment protection is facilitated.

Description

technical field [0001] The invention relates to an electroless plating technology, in particular to a composite additive for electroless plating and a copper plating solution composed of the same, which can significantly improve the performance of the plating solution and the plating layer in the electroless plating process. Background technique [0002] Polyvinylpyrrolidone, referred to as PVP, is a non-ionic polymer compound belonging to N-vinylamide polymers. It is soluble in both water and most organic solvents, has low toxicity and good physiological compatibility, and is widely used in the fields of medicine, food, cosmetics, polymer surfactants and catalyst preparation. [0003] Sodium diphenylamine sulfonate is a substance containing sulfur, nitrogen and benzene rings. It is a white crystalline powder, soluble in water and hot alcohol, and is often used as a redox indicator. [0004] Electroless copper (Electroless Copper) is a deposition process in which copper ion...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40
Inventor 李立清李敏廖春发黄志强安文娟王义赵靖华
Owner XINFENG ZHENGTIANWEI ELECTRONICS TECH