Three-dimensional finite element simulation method based on heat radiation boundary conditions

A technology of boundary conditions and simulation methods, applied in 3D modeling, image data processing, special data processing applications, etc., can solve problems such as lack of verification of complex models, failure to deal with radiation boundary problems, etc., and achieve the effect of solving insufficient applicability

Active Publication Date: 2018-01-12
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

Zhang Bo of Xi'an Jiaotong University proposed an indirect iterative method to deal with, but did not deal with the radiation boundary problem from the essence of the finite element, but

Method used

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  • Three-dimensional finite element simulation method based on heat radiation boundary conditions
  • Three-dimensional finite element simulation method based on heat radiation boundary conditions
  • Three-dimensional finite element simulation method based on heat radiation boundary conditions

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Embodiment Construction

[0021] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] refer to figure 1 , a three-dimensional finite element simulation method based on thermal radiation boundary conditions, including the following steps:

[0023] A. Model the target device and establish the corresponding geometric structure model.

[0024] B. The finite element weak form of the thermal radiation boundary condition is obtained by using the Galerkin weighted residual method.

[0025] In order to solve the thermal radiation boundary condition with finite element, it is necessary to construct the boundary value problem first, including two parts: the governing differential equation of heat conduction and the thermal radiation boundary condition, as shown in the following equation:

[0026]

[0027]

[0028] in is the Laplace operator, u is the temperature value in the solution domain, k i...

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Abstract

The present invention belongs to the technical field of numerical analysis of three-dimensional thermal analysis and relates to a three-dimensional finite element simulation method based on heat radiation boundary conditions. The method comprises: carrying out modeling on a device to be subjected to the thermal analysis, introducing radiation boundary conditions into the heat conduction problem, and obtaining the finite element weak form of the heat radiation boundary conditions by adopting the method of Galerkin residual weighting; using the tetrahedral meshed model to select the second-orderlaminated basis function and the discrete finite element weak form equation, obtaining a finite element matrix and aright-end vector by cooperating with the Newton-Raphson iteration method, and integrating the final equation; and finally, by using the scientific nonlinear convergence criteria, through continuous iteration, quickly and accurately obtaining final numerical results.

Description

technical field [0001] The invention belongs to the technical field of three-dimensional thermal analysis numerical solution, and relates to a three-dimensional finite element simulation method based on thermal radiation boundary conditions. Background technique [0002] As a satellite high-power core device, the space traveling wave tube is not only affected by the high and low temperature of the vacuum, but also by the long-term influence of space solar radiation, infrared radiation and vacuum cold black background temperature during the working process. These thermal environments will affect the space The electrical parameters and thermal stability of the TWT pose a serious threat to the normal operation of the TWT. In order to ensure that the various components of the space traveling wave tube maintain a normal operating temperature, the heat dissipation design becomes particularly important. Since the space traveling wave tube is exposed to the external vacuum environm...

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Application Information

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IPC IPC(8): G06F17/50G06T17/20
Inventor 徐立谢鹏李斌杨中海
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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