This invention discloses a method for locating abnormally overheating components on circuit boards based on thermal images. Starting from the characteristics of the thermal image itself, it obtains difference images under normal and abnormal conditions, and performs
image registration using an accelerated robust feature registration
algorithm optimized based on the Laplacian operator. This ensures that the difference images under abnormal and
normal conditions are well aligned after registration, resulting in a clear differential thermal image. Then,
outlier detection is performed on the differential thermal image using the Laplacian distribution, obtaining a differential thermal image after
outlier detection, thus initially identifying abnormally overheating regions and locating the abnormally overheating components. Finally,
kernel density estimation is used to determine the number of K-means clusters, and the K-means
algorithm is used to segment the differential thermal image after
outlier detection, obtaining a K-means segmented image. Morphological opening-closing operations are then performed on the image to remove minute lines. The thermal
image segmentation results of this invention can accurately provide information on abnormally overheating components, enabling accurate location and identification of these components, helping to narrow down the defect range and providing defect judgment information.