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Computer readable storage medium and vertical continuous pulse electroplating line applying computer readable storage medium

A storage medium and pulse electroplating technology, which is applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve the problem of reducing the roughness of the coating on the surface of the plate to be plated

Inactive Publication Date: 2018-01-19
东莞市开美电路板设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of depositing copper on the anode close to the connecting position of two copper plating tanks, and at the same time reduce the roughness of the coating on the surface of the plate to be plated after electroplating

Method used

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  • Computer readable storage medium and vertical continuous pulse electroplating line applying computer readable storage medium
  • Computer readable storage medium and vertical continuous pulse electroplating line applying computer readable storage medium
  • Computer readable storage medium and vertical continuous pulse electroplating line applying computer readable storage medium

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Embodiment Construction

[0021] Such as figure 1 As shown, the vertical continuous pulse plating line is provided with four continuous copper plating tanks A, B, C, D, and each copper plating tank is equipped with a rectifier R1, R2, which is used to adjust the pulse current in the plating tank. R3, R4, there is a programmable logic controller outside the tank body of the copper plating tank B, this programmable logic controller is connected to the rectifiers R1, R2, R3, R4 of each copper plating tank, in the programmable logic control The electroplating parameters and parameter switching time corresponding to the rectifiers R1, R2, R3, R4 are stored in the device, and the pulse current output by the rectifiers R1, R2, R3, and R4 of each electroplating tank can be controlled. The plate to be plated is hung on the hanging plate rack in the electroplating tank of the vertical continuous pulse electroplating line. Under the action of the pulse current output by the rectifiers R1, R2, R3, R4, the plate to ...

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Abstract

The invention relates to the technical field of pulse electroplating, in particular to a vertical continuous pulse electroplating line and a computer readable storage medium thereof. The readable storage medium is implemented by a computer program stored on a memorizer and capable of running on a processor. According to the vertical continuous pulse plating line, when a plate to be plated spans across two copper plating troughs, anodes in the two copper plating troughs are simultaneously in electrolytic reaction with the plate to be plated, because at this time pulse current output from the two anodes is the same, the voltage difference on the plate to be plated cannot be produced, and deposited copper on the two anodes is reduced, moreover, the plating rate of each part of the plate to beplated is stable, the plate surface of the plate to be plated and the interiors of holes are uniformly plated with dense plating, and the problem of the coarse plating on the plate surface of the plate to be plated is solved.

Description

Technical field [0001] The present invention relates to the technical field of pulse electroplating, and in particular to a vertical continuous pulse electroplating line and a computer-readable storage medium thereof. The readable storage medium is implemented by a computer program stored in a memory and running on a processor. Background technique [0002] Electroplating is a necessary process in the field of PCB manufacturing. The copper plating tank is equipped with an electroplating anode, and the plate to be plated is used as the electroplating cathode. The electrolytic reaction occurs with the electroplating anode in the electroplating solution, so that the surface and the hole of the plate to be plated are covered. Plated with copper. Among various electroplating equipment, the vertical continuous pulse electroplating line has good electroplating distribution, hole filling and hole filling capabilities, and the electroplating quality is stable, and the equipment takes up l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/12C25D5/18C25D19/00
Inventor 江新德高振声涂裔桂
Owner 东莞市开美电路板设备有限公司
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