A composite damping structure for airborne optoelectronic system

A technology of optoelectronic system and vibration reduction structure, which is applied in the direction of shock absorbers, shock absorbers, mechanical equipment, etc., can solve the problems of small effective space, high temperature resistance of rubber shock absorbers, poor low temperature performance, increasing the weight of optoelectronic systems, etc. , to increase the internal effective space, help to resist impact deformation, and overcome the effect of large static compression

Active Publication Date: 2019-05-31
西安应用光学研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the vibration damping structure is usually integrated and installed inside the optoelectronic system. This installation method not only occupies the effective space inside the optoelectronic system, but also increases the difficulty of maintenance of the vibration damping structure.
Moreover, in recent years, with the diversified needs of military development, the airborne optoelectronic system is required to develop in the direction of light weight, miniaturization and intelligence, so that the vibration reduction structure of the existing optoelectronic system can no longer meet the development needs of the optoelectronic system. Therefore, it is particularly important to design a vibration-reducing structure with high maintainability and suitable for new photoelectric systems.
[0003] Compared with other airborne mission equipment, the working environment of the optoelectronic system mainly has the following characteristics: ①The ambient temperature range is wide; ②The vibration-damping structure has both isolation requirements and positioning accuracy requirements; It is difficult to design the vibration-absorbing structure internally; ④The requirements for weight reduction are high, so it is difficult to obtain a large support stiffness; ⑤The use environment is complex and diverse, and it is easily affected by harsh environments such as temperature changes, humidity, vibration, and impact
At present, the vibration damping structure of the photoelectric system adopts rubber shock absorbers, which are symmetrically installed inside the photoelectric system, between the photoelectric sensor and the outer frame. The size of the photoelectric system; ②The weight of the photoelectric system is increased; ③The rubber shock absorber has poor high temperature and low temperature resistance, and its service life is limited, and the vibration reduction performance will decrease after long-term use; ④The shock absorber is poor in maintainability, and when replacing or maintaining the shock absorber The internal photoelectric sensor needs to be removed

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  • A composite damping structure for airborne optoelectronic system
  • A composite damping structure for airborne optoelectronic system
  • A composite damping structure for airborne optoelectronic system

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Embodiment Construction

[0020] In the present invention, the vibration damping structure is moved from the inside of the optoelectronic system to between the optoelectronic system and the carrier platform, which increases the effective space inside the optoelectronic system and creates conditions for the optoelectronic system to realize light weight and miniaturization; in terms of the design of the damping structure , adopts an integrated and compact structure design, and the vibration damping structure is designed as a semi-closed device that can be replaced as a whole. The internal components of the vibration damping structure are fully separated from the external harsh environment, ensuring high field maintainability and reliability. sex. The damping structure includes a circular upper end cover, a circular lower end cover connected with the airborne platform, a circular bearing plate connected with the photoelectric system, 8 steel wire rope shock absorbers uniformly distributed around the circum...

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Abstract

The invention provides a composite damping structure for an airborne photoelectric system. The composite damping structure comprises a round upper end cover, a round lower end cover connected with anairborne platform, a round bearing disc connected with the photoelectric system, eight steel wire rope dampers evenly distributed on the periphery, eight rubber dampers evenly distributed on the periphery and a cable connected with the photoelectric system and an upper computer. The upper end cover and the lower end cover are connected through bolts to form a cylindrical sealed inner cavity. The bearing disc is installed in the middle of the inner cavity, and the inner cavity is divided into an upper cavity and a lower cavity. The eight steel wire rope dampers and the eight rubber dampers areevenly distributed in the circumferential direction of the bearing disc in the lower cavity. The cable is arranged and connected into the upper cavity. According to the composite damping structure, the damping structure is externally moved from the interior of the photoelectric system to the position between the photoelectric system and the airborne platform, integrated and compact structure design is used in the aspect of design of the damping structure, the damping structure is designed as a half-closed device which can be replaced wholly, interior components of the damping structure are completely separated from the exterior harsh environment, and the high outer field maintenance and reliability are ensured.

Description

technical field [0001] The invention belongs to the field of airborne optoelectronic vibration reduction technology, and relates to a composite type vibration reduction structure used in an airborne optoelectronic system. This structure combines the advantages of steel wire rope shock absorbers and rubber shock absorbers in terms of vibration isolation and buffering. load photoelectric system. Background technique [0002] As an important mission equipment of the aircraft platform, the optoelectronic system has combat capabilities such as battlefield reconnaissance, target tracking and indication. The vibration damping structure is the only vibration damping and buffering device in the optoelectronic system, which is used to reduce the influence of the vibration and impact of the carrier platform on the performance of the optoelectronic system. At present, the vibration damping structure is usually integrated and installed inside the photovoltaic system. This installation ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16F7/00B64D47/00
Inventor 郑凤翥王惠林杨光宁飞成刚赵志草常新宇边赟刘超孙勇霍丽烨
Owner 西安应用光学研究所
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