Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Three-dimensional high-density fan-out package structure and manufacture method thereof

A packaging structure, fan-out technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of high manufacturing cost, complex process, and high packaging thickness

Active Publication Date: 2018-01-23
NAT CENT FOR ADVANCED PACKAGING
View PDF14 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Most of these three-dimensional integrated circuit packaging structures and methods based on the prior art need to use PCB circuit boards, adapter boards and TSV through holes, which have high manufacturing costs, complicated processes, and high packaging thickness.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional high-density fan-out package structure and manufacture method thereof
  • Three-dimensional high-density fan-out package structure and manufacture method thereof
  • Three-dimensional high-density fan-out package structure and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0041] In this specification, reference to "one embodiment" or "the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An embodiment of the invention discloses a three-dimensional fan-out package structure. The structure comprises a first chip, one or more second metal columns, a second chip, a second insulation resin, and a re-wiring structure, wherein the one or more second metal columns are arranged at the periphery of the first chip, the second chip is formed by one or more chips, the second chip is stacked onthe back of the first chip, a surface pad of the second chip is electrically connected to the second metal column through a metal wire, the second insulation resin wraps the first chip, the second chip and the second metal columns, and the surface of a first metal column, the surface of a first insulation resin, the bottom surface of the second metal column and the bottom surface of the second insulation resin are flush with one another. The package structure disclosed in the invention has the advantages of small size and low cost.

Description

technical field [0001] The invention relates to the packaging field, in particular to an ultra-thin three-dimensional high-density fan-out packaging structure and a manufacturing method thereof. Background technique [0002] Three-dimensional integrated circuit packaging has many advantages, such as high packaging density and small footprint. There are various three-dimensional integrated circuit packaging structures and three-dimensional integrated circuit packaging methods in the prior art. [0003] Image 6 A schematic cross-sectional view of a prior art PoP (package on package) package structure is shown. The PoP package is fabricated by stacking two packages, including a top package 101 and a bottom package 102 , with a total thickness of approximately 1.4mm. Top package 101 contains stacked die 103 . The top package 101 and the bottom package 102 each contain a circuit board (circuit board thickness 0.3 mm) and a set of solder balls 104 (solder ball height 0.25 mm)....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/065H01L25/18H01L23/488H01L21/98
CPCH01L2924/181H01L2224/16225H01L2224/32145H01L2224/48091H01L2224/73253H01L2224/73265H01L2924/00012H01L2924/00014
Inventor 陈峰张文奇
Owner NAT CENT FOR ADVANCED PACKAGING
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com