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Toothed buffered mounting machine

A placement machine and gear-type technology, which is applied in the direction of electrical components, electrical components, electrical components to assemble printed circuits, etc., can solve the problems of crushing circuit boards, suction nozzles without buffer devices, and damaged components, so as to prevent damage to components or circuit board effects

Inactive Publication Date: 2018-01-26
江门市睿智隽永科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because surface mount components are simple and easy to use, but small in size, placement machines are usually used for placement, but the existing placement machine suction nozzles do not have buffer devices, which can easily damage components or even crush circuit boards

Method used

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  • Toothed buffered mounting machine
  • Toothed buffered mounting machine

Examples

Experimental program
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Embodiment Construction

[0014] refer to Figure 1~2 , a tooth-type buffer placement machine, including a suction nozzle, the suction nozzle includes a nozzle head 1, a pressure relief device 2, an air valve station 3, a pressure sensing device 4 and a control unit, and the nozzle head 1 is connected to the pressure relief device 2 , a pressure sensing device 4 is provided between the nozzle 1 and the pressure relief device 2, the nozzle 1 is connected to the valve station 3, the pressure relief device 2 is connected to the valve station 3, the pressure sensing device 4 is connected to the control unit, The gas valve station 3 is connected with the control unit.

[0015] The nozzle 1 contacts the components and transmits the impact to the pressure relief device 2. The pressure relief device 2 is connected to the air valve station 3 and absorbs the shock to the maximum through the air pressure. The pressure sensing device 4 monitors the impact on the nozzle 1. And transmit relevant information to the ...

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PUM

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Abstract

The invention relates to the field of surface mounting, and discloses a toothed buffered mounting machine. A tip touches an element and transmits an impact to a pressure-buffering device, the pressure-buffering device is connected with an air valve station, the impact is absorbed to the maximum extent through air pressure, a pressure sensing device monitors the impact on the tip and sends relevantinformation to a control unit, the control unit controls the air valve station, and the air valve station adjusts the pressure-buffering device so as to prevent damage to the element or a circuit board when the tip contacts the element.

Description

technical field [0001] The invention relates to the field of surface packaging, in particular to a toothed buffer placement machine. Background technique [0002] With the miniaturization of electronic components, circuit boards mostly use surface mount components. Because surface mount components are simple and easy to use, but small in size, placement machines are usually used for placement. However, the existing placement machine suction nozzle has no buffer device, which can easily damage the components or even crush the circuit board. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the present invention provides a tooth-type buffer placement machine, which absorbs the impact on the components when the nozzle touches the components through the air valve station, control unit, pressure sensor, and pressure relief device, preventing damage to the components or circuit boards . [0004] The technical solution adopted by the pre...

Claims

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Application Information

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IPC IPC(8): H05K3/30H05K13/04
Inventor 容加权
Owner 江门市睿智隽永科技有限公司