Method and system for inspecting return path vias

Abstract

The present application discloses a return path via inspection method and system, the method comprising: identifying all signal vias and return path vias in the target PCB board; calculating the distance between each signal via and all return path vias respectively , to obtain the corresponding N groups of distances; wherein, the N value is consistent with the number of signal vias in the target PCB board; respectively determine the distance with the smallest corresponding distance value from each group of distances, and obtain the corresponding N shortest distances ; Determine whether each shortest distance is less than a preset distance threshold; if yes, determine that the return path via corresponding to the shortest distance complies with the layout specification; if not, determine that the return path via corresponding to the shortest distance does not conform to layout specification. This application calculates the shortest distance between the signal via hole and the return path via using the calculation software commonly used in computers, and then judges whether the return path aperture conforms to the layout specification, which greatly shortens the inspection time of the signal path via.

Description

technical field [0001] The invention relates to the field of circuits, in particular to a method and system for inspecting return path vias. Background technique [0002] A transmission line for a signal carries the signal from one end to the other. All transmission lines are composed of two paths, one of which is called the signal path, and the other is called the return path, such as figure 1 shown. In the four-layer circuit transmission line, such as figure 2 As shown, the first layer circuit and the fourth layer circuit are the signal layer, and the second layer circuit and the third layer circuit are the GND layer, that is, the reference plane. Such as figure 2 As shown in the transmission direction of the signal in , the signal path starts from the first layer circuit and connects to the fourth layer circuit through the signal via. The return current will switch from the third layer circuit back to the second layer circuit. At this time, the return path is disc...

AI Technical Summary

Problems solved by technology

However, any PCB board has many vias, so this method is very time-consuming

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