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Mesh Simplification Method Based on Plane Fitting in 3D Reconstruction

A technology of plane fitting and 3D reconstruction, applied in the field of 3D reconstruction technology, can solve problems such as inapplicable 3D point cloud surface reconstruction

Active Publication Date: 2020-03-27
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional Delaunay triangulation algorithm is not suitable for massive 3D point cloud surface reconstruction

Method used

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  • Mesh Simplification Method Based on Plane Fitting in 3D Reconstruction
  • Mesh Simplification Method Based on Plane Fitting in 3D Reconstruction

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Embodiment Construction

[0050] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the implementation methods and accompanying drawings.

[0051] The grid simplification method based on plane fitting in the 3D reconstruction of the present invention is mainly aimed at the surface reconstruction of the point cloud in the case of a large number of point cloud 3D models, where there are many plane areas and the resolution of the details is required to be high. In many industrial needs, in order to realize the accurate measurement of 3D models and simultaneously perform 3D display, dense high-resolution 3D point cloud data is obtained through high-resolution devices such as 3D scanners. The data is characterized by orderly arrangement and denseness, and High precision. Massive point clouds with high resolution are sufficient to meet the basic requirements of accurate measureme...

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Abstract

The invention discloses a grid simplification method based on plane fitting in three-dimensional reconstruction. The present invention first performs point plane extraction and plane clustering on the point cloud to obtain the point cloud of the separation plane and details; then performs plane edge extraction, edge down-sampling, plane interior removal and down-sampling, and plane edge and interior combination on the separation plane. Combining triangulation and triangulation planes to obtain the triangulation splicing results of the separation planes; and triangulation processing on the point cloud of the details to obtain the triangulation results of the details; finally, combining the triangulation results of the details and the triangulation of the separation planes Merge the results to get the mesh simplification result. The invention can greatly reduce the storage space of point cloud grid data, and is more conducive to the real-time transmission and processing of three-dimensional data; and no error will be introduced in the point cloud measurement; The software and hardware requirements for cloud surface display can be displayed more smoothly and quickly.

Description

technical field [0001] The invention belongs to the technical fields of computer graphics and computer vision, and in particular relates to a three-dimensional reconstruction technology. Background technique [0002] With the development of 3D scanning technology and 3D reconstruction technology, people are acquiring more and more 3D data, which are widely used in virtual reality, reverse engineering, robotics, 3D object detection and recognition and other fields. With the continuous increase of 3D data acquired, stored and processed, the representation of 3D data has become a hot research topic. Three-dimensional data is commonly used to represent the shape information of objects or used in the field of industrial measurement. Due to the requirements for measurement accuracy, the resolution of many devices has reached below the millimeter level, which leads to a very large amount of 3D point cloud data obtained from objects. For expressing the shape of an object or within ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T19/20
CPCG06T19/20
Inventor 刘光辉孙铁成杨一峰罗森
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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