Mesh simplification method in three dimensional reconstruction based on plane fitting

A technology of plane fitting and 3D reconstruction, which is applied in the field of 3D reconstruction technology and can solve problems such as inapplicable 3D point cloud surface reconstruction.

Active Publication Date: 2018-02-09
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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The traditional Delaunay triangulation algorithm is not s

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  • Mesh simplification method in three dimensional reconstruction based on plane fitting
  • Mesh simplification method in three dimensional reconstruction based on plane fitting

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[0050] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the implementation methods and accompanying drawings.

[0051] The grid simplification method based on plane fitting in the 3D reconstruction of the present invention is mainly aimed at the surface reconstruction of the point cloud in the case of a large number of point cloud 3D models, where there are many plane areas and the resolution of the details is required to be high. In many industrial needs, in order to realize the accurate measurement of 3D models and simultaneously perform 3D display, dense high-resolution 3D point cloud data is obtained through high-resolution devices such as 3D scanners. The data is characterized by orderly arrangement and denseness, and High precision. Massive point clouds with high resolution are sufficient to meet the basic requirements of accurate measureme...

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Abstract

The invention discloses a mesh simplification method in three dimensional reconstruction based on plane fitting. The method comprises the steps: firstly carrying out the point and plane extraction andplane clustering of a point cloud, and obtaining a separated plane and a detail part point cloud; secondly carrying out the plane edge extraction, edge downsampling, plane internal point removing anddownsampling, plane edge and interior combination and triangularization and triangularization plane combination, and obtaining a triangularization splicing result of separation planes; thirdly carrying out the triangularization processing of the detail part point cloud, and obtaining a triangularization processing result of the details; finally combining the triangularization processing result ofthe details with the triangularization splicing result of the separation planes, and obtaining a mesh simplification result. The method can greatly reduce the storage space of point cloud mesh data,and facilitates the real-time transmission and processing of three-dimensional data in a better way. Moreover, no error is introduced to the point cloud measurement. Meanwhile, because of the reduction of the number of points and the number of planes, the method reduces the hardware and software requirements for the point cloud surface display, and can achieve the more fluent and quicker display.

Description

technical field [0001] The invention belongs to the technical fields of computer graphics and computer vision, and in particular relates to a three-dimensional reconstruction technology. Background technique [0002] With the development of 3D scanning technology and 3D reconstruction technology, people are acquiring more and more 3D data, which are widely used in virtual reality, reverse engineering, robotics, 3D object detection and recognition and other fields. With the continuous increase of 3D data acquired, stored and processed, the representation of 3D data has become a hot research topic. Three-dimensional data is commonly used to represent the shape information of objects or used in the field of industrial measurement. Due to the requirements for measurement accuracy, the resolution of many devices has reached below the millimeter level, which leads to a very large amount of 3D point cloud data obtained from objects. For expressing the shape of an object or within ...

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Application Information

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IPC IPC(8): G06T19/20
CPCG06T19/20
Inventor 刘光辉孙铁成杨一峰罗森
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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