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laser cutting method

A laser cutting and laser technology, applied in laser welding equipment, metal processing equipment, welding equipment and other directions, can solve the problems of easy thermal stress, concentration, deformation, etc.

Active Publication Date: 2019-08-20
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology

However, in the process of laser cutting, due to the high energy density of the laser, a large temperature gradient is generated between the cutting position and its surrounding non-cutting positions, resulting in thermal stress between the cutting position and its nearby positions. In turn, it is easy to produce cracks in the direction of the temperature gradient
Especially for irregular cutting areas such as chamfering and perforation, it is easy to produce irregular deformation and concentration of thermal stress, which makes cracks and other defects more likely to occur, which in turn affects the quality of display panel products

Method used

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Embodiment Construction

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Among them, the drawings are only used for exemplary description, and they are only schematic diagrams and cannot be understood as a limitation of the patent.

[0023] Please participate figure 1 , The present invention provides a laser cutting method, the laser cutting method includes the steps:

[0024] Step 110, please refer to figure 2 and image 3 , Cover the heat absorption layer 20 on the cutting track of the substrate 10 to be cut.

[0025] In the present invention, the substrate 10 to be cut is cut by means of laser cutting. The cutting includes cutting the substrate 10 to be cut to obtain a substrate of a suitable size, and also includes chamfering and perforating the substrate 10 to be cut to obtain a good appearance effect or meet certain usage requirements. Substrate. In...

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Abstract

A cutting method employing a laser (11). Before a laser (11) has been used to perform a cutting operation, a heat absorption layer (20) is laid over a cutting path on a substrate to undergo a cutting operation, such that when the laser (11) cuts the substrate (10) along the cutting path on the substrate (10), the heat absorption layer (20) can partially absorb heat of the laser (11), thereby reducing a temperature gradient between a cut section and a non-cut section surrounding the cut section on the substrate (10) during cutting, reducing generation of heat stress and formation of defects, such as cracks, and providing a product of good quality.

Description

Technical field [0001] The invention relates to the technical field of display panel manufacturing, in particular to a laser cutting method. Background technique [0002] In the manufacturing process of the existing display panel, the whole motherboard is usually cut to obtain a display panel of suitable size. Among them, laser cutting is a common way. However, in the process of laser cutting, due to the high energy density of the laser, a large temperature gradient is generated between the cutting position and the surrounding non-cutting positions, resulting in thermal stress between the cutting position and its nearby positions. In turn, cracks are easily generated in the direction of pressing the temperature gradient. Especially for irregular cut areas such as chamfers and perforations, irregular deformations are prone to generate heat stress concentration, and defects such as cracks are more likely to occur, thereby affecting the quality of display panel products. Summary ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/402
Inventor 袁朝煜
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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